Partial recipeSource: Main
Route 1: Electrochemical
9 · Experimental Section
Metal precursorsCopper foam; Cu(OH)2/CF formed in situ by anodic oxidation.
Linker precursorsHHTP ligand; amount not separately stated, similar to HITP route.
SolventsAnhydrous ethanol and deionised water; assumed same volumes as HITP route from main-text 'similar' statement.
AdditivesAmmonia; 2 M KOH for anodic oxidation.
Atmospherenot reported
Temperatureroom temperature for ligand conversion
Time0.0833 h anodic oxidation plus 1.333 h ligand conversion, inferred from analogous route
Substrate orientationCopper foam substrate; orientation not specified.
Oxidant / reductantAnodic oxidation in 2 M KOH at 10 mA cm-2 for 300 s generates Cu(OH)2 nanorods.
Work-upCopper foam cleaned with water and ethanol ultrasonication before oxidation; no post-conversion washing/drying specified in main text.
Activationnot reported
Show 6 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|---|---|---|
| Metal Source | copper foam | Not specified | 9 · Experimental Section |
| Electrolyte | KOH | 2 M | 9 · Experimental Section |
| Linker | HHTP | not stated | 9 · Experimental Section |
| Solvent | anhydrous ethanol | inferred 5 mL | 9 · Experimental Section |
| Solvent | deionized water | inferred 2 mL | 9 · Experimental Section |
| Base | ammonia | inferred 40 uL | 9 · Experimental Section |