Metal precursorsCuSO4 electrolyte and Cu foil working electrode
Solventsaqueous electrolyte
Additives0.2 mM cetyltrimethyl ammonium bromide (CTAB)
Time0.0417
Substrate orientationCu foil working electrode, 1 cm2
Oxidant / reductant0.5 M H2SO4 + 0.1 M CuSO4 oxidising electrolyte; hydrogen-bubble-templated electrodeposition
Work-upPrior to electrodeposition, Cu foil polished with 800 and 1200 grit abrasive paper, rinsed with deionised water and ethanol.
Scalability contextElectrodeposition on 1 cm2 Cu foil; no scale-up study reported.
Show 5 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|
| Electrolyte | H2SO4 | 0.5 M | S-2 · 1.1 Synthesis of Cu2O-Cu NDs and Annealed NDs |
| Metal Source | CuSO4 | 0.1 M | S-2 · 1.1 Synthesis of Cu2O-Cu NDs and Annealed NDs |
| Additive | Cetyltrimethyl Ammonium Bromide (CTAB) | 0.2 mM | S-2 · 1.1 Synthesis of Cu2O-Cu NDs and Annealed NDs |
| Other | Cu foil working electrode | 1 cm2 | S-2 · 1.1 Synthesis of Cu2O-Cu NDs and Annealed NDs |
| Other | platinum foil counter electrode | 1.5 cm2 | S-2 · 1.1 Synthesis of Cu2O-Cu NDs and Annealed NDs |