Synthesis evidence

Characterization of a copper phosphate triazole metal organic framework material (Cu3PO4(C2N3H 2)2OH) and oxygen evolution studies

Bagtache R., Rekhila G., Abdmeziem K. et al. · Materials Science in Semiconductor Processing · 2014 · 144-150

2 structured synthesis routes

Completeness describes how fully the route could be reconstructed from the main article and supporting information.

Partial recipeSource: Main

Route 1: Hydrothermal

2 · 2.1 Synthesis

Metal precursorsCuCl2.2H2O (0.51 g)
Linker precursors1,2,4-triazole (0.27 g)
SolventsWater (20 mL)
AdditivesNaF (0.20 g), H3PO4 85 wt% (0.72 g), KOH solution 6.3 M (2.75 mL)
AtmosphereAutogenous pressure in sealed Teflon-lined stainless steel autoclave; gas atmosphere not otherwise reported.
Temperature180
Time120-144
Work-upAfter cooling, product recovered by filtration, washed thoroughly with water and dried at 60 C overnight.
ActivationNo separate activation reported.
Show 6 structured reagent records
RoleReagentAmount / concentrationSource
Metal SourceCuCl2.2H2O0.51 g2 · 2.1 Synthesis
Solventwater20 mL2 · 2.1 Synthesis
AdditiveNaF0.20 g2 · 2.1 Synthesis
Linker1,2,4-triazole0.27 g2 · 2.1 Synthesis
AcidH3PO40.72 g · 85 wt%2 · 2.1 Synthesis
BaseKOH solution2.75 mL · 6.3 M2 · 2.1 Synthesis
Partial recipeSource: Main

Route 2: Other

2 · 2.2 Characterization

AdditivesSilver paint, copper wires, epoxy resin and glass holder used for contact/encapsulation.
AtmosphereHelium atmosphere used for dielectric measurements; preparation atmosphere not specified.
Temperature180
Work-upPowder ground, pressed into pellets, sintered, contacted with copper wires using silver paint, encapsulated with epoxy resin while leaving 1.32 cm2 projected surface area.
ActivationNo chemical activation reported.
Show 4 structured reagent records
RoleReagentAmount / concentrationSource
OtherCu3PO4(C2N3H2)2OH powderNot specified2 · 2.2 Characterization
Additivesilver paintNot specified2 · 2.2 Characterization
Othercopper wiresNot specified2 · 2.2 Characterization
Additiveepoxy resinNot specified2 · 2.2 Characterization