Synthesis · A Cu-based electronically conducting metal–organic framework with π–d conjugation for cathode and anode modification in aqueous zinc-ion batteries

6 structured synthesis routes

Completeness describes how fully the route could be reconstructed from the main article and supporting information.

Partial recipeSource: Main

Route 1: Drop Cast

2 · 2.2.1

SolventsN-methyl-2-pyrrolidone (NMP)

Additivesconductive additive; PVDF

Atmospherenot specified

Temperaturenot specified

Timenot specified

Substrate orientationstainless-steel mesh

Work-upSlurry coated on stainless-steel mesh; dried; cut into electrodes with radius 7.5 mm.

Show 4 structured reagent records

Role	Reagent	Amount / concentration	Source
Other	DDA-Cu sample	6 mass parts	2 · 2.2.1
Additive	conductive additive	3 mass parts	2 · 2.2.1
Additive	polyvinylidene fluoride (PVDF)	1 mass part	2 · 2.2.1
Solvent	N-methyl-2-pyrrolidone (NMP)	not specified	2 · 2.2.1

Partial recipeSource: Main

Route 2: Solvothermal

2 · 2.2.1

Metal precursorsCu(CH3COO)2.H2O, 276 mg

Linker precursorsDDA, 300 mg

Solventsanhydrous DMF 150 mL; deionized water 75 mL; DMF 75 mL; ethanol/water washing

Atmospherenot specified

Temperature100; vacuum dry 70

Timewhole day; dry 12 h

Work-upCentrifuged repeatedly with ethanol and water; vacuum dried; ground in agate mortar.

Scalability contextAuthors state DDA ligand offers economic benefits versus previously reported EC-MOF cathodes, but no scale/yield reported.

Show 6 structured reagent records

Role	Reagent	Amount / concentration	Source
Linker	DDA	300 mg	2 · 2.2.1
Solvent	anhydrous N,N-dimethylformamide (DMF)	150 mL	2 · 2.2.1
Metal Source	Cu(CH3COO)2.H2O	276 mg	2 · 2.2.1
Solvent	ultrapure deionized water	75 mL	2 · 2.2.1
Solvent	DMF	75 mL	2 · 2.2.1
Solvent	ethanol and water	not specified	2 · 2.2.1

Partial recipeSource: Main

Route 3: Other

3 · 2.2.3

Metal precursorsV2O5, 1.5 g; NaCl, 5.844 g

Solventsdeionized water 50 mL; ethanol/water washing; NMP for electrode slurry

Additivesacetylene black; PVDF

Atmosphereambient conditions for stirring; not specified for drying

Temperatureambient stirring; vacuum dry 80; electrode dry 70

Time72 h stirring; 12 h vacuum drying

Substrate orientationcurrent collector

Work-upCentrifuged, washed with water and ethanol, vacuum dried, ground, mixed into slurry and dried on current collector.

Show 6 structured reagent records

Role	Reagent	Amount / concentration	Source
Other	sodium chloride (NaCl)	5.844 g	3 · 2.2.3
Other	V2O5	1.5 g	3 · 2.2.3
Solvent	deionized water	50 mL	3 · 2.2.3
Additive	acetylene black	20 %	3 · 2.2.3
Additive	PVDF binder	10 %	3 · 2.2.3
Solvent	NMP	not specified	3 · 2.2.3

Partial recipeSource: Main

Route 4: Liquid Liquid Interface

11 · Results and discussion · Fig. 9

Metal precursorsas for Zn@DDA-Cu; zinc foil substrate

Linker precursorsDDA

Solventsdichloromethane; water

Atmospherenot specified

Temperatureambient standing

Time24 h film growth

Substrate orientationtransferred to zinc foil

Work-upNot restated; inferred same transfer process as Zn@DDA-Cu with shorter growth time.

Show 3 structured reagent records

Role	Reagent	Amount / concentration	Source
Linker	DDA	not restated	11 · Results and discussion · Fig. 9
Metal Source	copper acetate	not restated	11 · Results and discussion · Fig. 9
Other	zinc foil	not restated	11 · Results and discussion · Fig. 9

Partial recipeSource: Main

Route 5: Liquid Liquid Interface

11 · Results and discussion · Fig. 9

Metal precursorsas for Zn@DDA-Cu; zinc foil substrate

Linker precursorsDDA

Solventsdichloromethane; water

Atmospherenot specified

Temperatureambient standing

Time48 h film growth

Substrate orientationtransferred to zinc foil

Work-upNot restated; inferred same transfer process as Zn@DDA-Cu with shorter growth time.

Show 3 structured reagent records

Role	Reagent	Amount / concentration	Source
Linker	DDA	not restated	11 · Results and discussion · Fig. 9
Metal Source	copper acetate	not restated	11 · Results and discussion · Fig. 9
Other	zinc foil	not restated	11 · Results and discussion · Fig. 9

Partial recipeSource: Main

Route 6: Liquid Liquid Interface

2-3 · 2.2.2 · Fig. 1a

Metal precursorscopper acetate, 13.5 mg; zinc foil substrate

Linker precursorsDDA, 3.5 mg

Solventsdichloromethane 130 mL; deionized water 100 mL; water and ethanol cleaning

Atmospherenot specified

Temperatureambient standing; dry 40

Time30 min sonication; 3 d standing; dry time not specified

Substrate orientationDDA-Cu film transferred onto circular zinc foil disk, radius 7.5 mm

Work-upZinc foil ultrasonically cleaned with deionized water and ethanol; interfacial DDA-Cu film transferred to zinc sheet; dried at 40 C.

Scalability contextLarge-area film reported, but dimensions and yield not specified.

Show 5 structured reagent records

Role	Reagent	Amount / concentration	Source
Linker	DDA	3.5 mg	2-3 · 2.2.2 · Fig. 1a
Solvent	dichloromethane	130 mL	2-3 · 2.2.2 · Fig. 1a
Metal Source	copper acetate	13.5 mg	2-3 · 2.2.2 · Fig. 1a
Solvent	deionized water	100 mL	2-3 · 2.2.2 · Fig. 1a
Other	zinc foil	circular disk, radius 7.5 mm	2-3 · 2.2.2 · Fig. 1a