Reported material

Cu-TCNQ/Cu-BPyDC heterostructured thin film

This group combines only harmless case, dash and spacing variants of the reported identity. It does not assert a broader chemical equivalence without source review.

1primary papers
1material records
2linked samples
9linked measurements
27linked results
2022–2022publication span

Evidence coverage

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Primary papers

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1 papers

Per-paper identity records

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Show 1 material identity record
Paper and reported nameFormula and componentsStructure contextSource
Cu-TCNQ/Cu-BPyDC heterostructured thin film2022 · Charge-transfer interface of insulating metal-organic frameworks with metallic conductionCu(I)-TCNQ/Cu(II)-BPyDC; phase-I DFT interface C236H200N48O64Cu16Cu(I) in Cu-TCNQ and Cu(II) in Cu-BPyDC · TCNQ and BPyDCunknown · CompositeLayered heterostructured thin film with FTO/Cu-BPyDC/Cu-TCNQ layers and a Cu(I)/Cu(II) interface.2 · Introduction/Results · Fig. 1; Fig. 2b