Complete recipeSource: Main
Route 1: Other
937 · Experimental Section - Device fabrication · Figure 3
Metal precursorspoly[Nax(Ni-ett)] and poly[Cux(Cu-ett)] compressed polymer samples
Linker precursorsett-containing polymer legs already synthesised
Additivessilver paste (EPO-TEK H20E)
Atmosphereambient atmosphere for electrical-property measurement
Substrate orientation42 mm x 42 mm AlN wafer support substrate; 35 patterned bottom silver electrodes
Work-upCompressed p- and n-type samples with 50 nm evaporated Au layer on one side were adhered to Ag electrodes; 50 nm Au electrodes were thermally evaporated on the other side through a shadow mask and interconnected by Al foils.
Scalability contextModule has packing density 0.40; authors extrapolate higher power density for packing density 0.94.
Show 7 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|---|---|---|
| Other | poly[Nax(Ni-ett)] compressed sample | 2 mm x 5 mm x 0.9 mm legs | 937 · Experimental Section - Device fabrication · Figure 3 |
| Other | poly[Cux(Cu-ett)] compressed sample | 2 mm x 5 mm x 0.9 mm legs | 937 · Experimental Section - Device fabrication · Figure 3 |
| Other | AlN wafer | 42 mm x 42 mm | 937 · Experimental Section - Device fabrication · Figure 3 |
| Other | silver electrodes | 35 patterned bottom electrodes, each 2 mm x 12 mm and 2 mm apart | 937 · Experimental Section - Device fabrication · Figure 3 |
| Other | Au | 50 nm evaporated layers/electrodes | 937 · Experimental Section - Device fabrication · Figure 3 |
| Additive | silver paste EPO-TEK H20E | Not specified | 937 · Experimental Section - Device fabrication · Figure 3 |
| Other | Al foils | Not specified | 937 · Experimental Section - Device fabrication · Figure 3 |