Complete recipeSource: Main
Route 1: Other
p007 · Fabrication of M-HHTP and M-TCPP thin film
Metal precursorsnickel acetate tetrahydrate or copper acetate monohydrate, 5 mM in ethanol
Linker precursorsHHTP or TCPP, 5 mM in ethanol
Solventsethanol; ethanol rinse
Atmosphereambient/air not otherwise specified
Temperatureroom temperature deposition; dried at 70 C after each layer
Time30 s stand after each spray; 10 s ethanol rinse per layer
Substrate orientationfabrics; different metal-ligand combinations deposited independently to avoid cross-contamination
Work-upEthanol rinse and drying at 70 C after each layer.
ActivationNo separate activation reported.
Scalability contextSpraying pressure 160 kPa, ultrasonic atomising nozzle diameter 0.3 mm.
Show 3 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|---|---|---|
| Metal Source | nickel acetate tetrahydrate (C4H6NiO4.4H2O, >=99%) | 0.2 mL sprayed per layer · 5 mM ethanol solution | p007 · Fabrication of M-HHTP and M-TCPP thin film |
| Metal Source | copper acetate monohydrate (C4H6CuO4.H2O, >=99%) | 0.2 mL sprayed per layer · 5 mM ethanol solution | p007 · Fabrication of M-HHTP and M-TCPP thin film |
| Linker | HHTP or TCPP | 0.2 mL sprayed per layer · 5 mM ethanol solution | p007 · Fabrication of M-HHTP and M-TCPP thin film |