Reported material

Cu-DHHBTN

This group combines only harmless case, dash and spacing variants of the reported identity. It does not assert a broader chemical equivalence without source review.

1primary papers
1material records
5linked samples
9linked measurements
36linked results
2024–2024publication span

Evidence coverage

Paper counts are material-linked through samples and measurements; technique groups are not value rankings.

Publication timeline

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Primary papers

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1 papers

Per-paper identity records

Raw names, formulas and structural assignments remain separate; no consensus value is inferred.

Show 1 material identity record
Paper and reported nameFormula and componentsStructure contextSource
Cu-DHHBTN2024 · Two-Dimensional Conjugated Metal–Organic Frameworks with a Ring-in-Ring Topology and High Electrical ConductanceCu3(C54H18O12)Cu MO4-type nodes; mixed Cu(II)/Cu(I) by XPS · DHHBTN catecholate/semiquinone/quinone ligand2D · PristineRing-in-ring dual-pore honeycomb topology; slipped-parallel layered packing; a=29.73 A, b=30.04 A, c=3.47 A.2 · Structural Characterizations · Figure 2; Figure S7c