Primary study2025
Solvent-Directed Assembly of π-Stacked 3D Metal-Organic Frameworks with Tunable Conductivity Enhanced by C60 Encapsulation
Tang X., Wang X., Su S. et al. · Journal of the American Chemical Society · 2025
Reported here: NU-4003-C60
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1 papers
Tang X., Wang X., Su S. et al. · Journal of the American Chemical Society · 2025
Reported here: NU-4003-C60
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| Paper and reported name | Formula and components | Structure context | Source |
|---|---|---|---|
| NU-4003-C602025 · Solvent-Directed Assembly of π-Stacked 3D Metal-Organic Frameworks with Tunable Conductivity Enhanced by C60 Encapsulation | NU-4003 host with encapsulated C60; full-loading sample about 38 wt % C60NU-4003 Cu-chain framework · H6L plus C60 guest | 3D · Compositehost-guest adduct retaining NU-4003 crystallinity by PXRD and DFT-optimised host-guest model | main p006 / journal p20904 · Electrical Conductivity · Table 1 |