Other — Conductive Stimuli-Responsive Coordination Network Linked with Bismuth for Chemiresistive Gas Sensing

Measurement evidence

Other

Conductive Stimuli-Responsive Coordination Network Linked with Bismuth for Chemiresistive Gas Sensing · Aykanat A., Jones C.G., Cline E. et al. · ACS Applied Materials and Interfaces · 2021 · 60306-60318

2 measurement groups · 8 results

Reported values remain attached to the sample, method, conditions, extraction quality and source location that produced them.

combustion elemental analysis and ICP-MS

Bulk elemental and compositional analysis

Bi(HHTP) powder from Procedure 1, 2:1 metal:ligand · Powder

Bi(HHTP) activated in ethyl acetate 2 days, dried/stored >3 weeks; C/H combustion, Bi ICP-MS after H2O2 dissolution

Context: pristine
Measurement source: S19-S20 · Elemental Analysis of Bi(HHTP) · Table S2

Property	Reported value	Normalised value	Uncertainty	Origin and quality	Source
found bismuth	33.1%	—	—	SI Table Exact Reported	S20 · Elemental Analysis · Table S2
found carbon	38.3%	—	—	SI Table Exact Reported	S20 · Elemental Analysis · Table S2
found hydrogen	1.73%	—	—	SI Table Exact Reported	S20 · Elemental Analysis · Table S2

thermogravimetric analysis

Thermogravimetric analysis

Bi(HHTP) powder from Procedure 2, 1:1 metal:ligand · Powder

TA Instruments TGA, 20 C/min ramp under N2; SI text says 25-900 C on TGA 55; Figure S23 caption says room temperature to 800 C on TGA Q150

Atmosphere: N2
Context: pristine
Measurement source: S20-S21 · Thermogravimetric Analysis · Figure S23

Property	Reported value	Normalised value	Uncertainty	Origin and quality	Source
Bi(OAc)3 precursor mass loss	38%	—	—	Text Exact Reported	60311 · Thermal Analysis · Figure S23
highest decomposition rate temperature	466 C	—	—	Text Exact Reported	60310 · Thermal Analysis · Figure S23
HHTP precursor mass loss	56%	—	—	Text Exact Reported	60311 · Thermal Analysis · Figure S23
initial mass loss	~8% from 100-200 C	—	—	Text Approximate	60310 · Thermal Analysis · Figure S23
total weight loss	~34%	—	—	Text Approximate	60310 · Thermal Analysis · Figure S23