Partial recipeSource: SI
Route 1: Other
S2 · Electrochemical Measurements
Metal precursorsDDA-Cu active material
Solventsslurry solvent not specified
AdditivesSuper-P; CMC/SBR binder mass ratio 1:1
Atmosphereargon glovebox for cell assembly; O2 and H2O below 0.1 ppm
Temperature70
Time12
Substrate orientationcarbon-coated aluminium foil
Work-upslurry cast on carbon-coated aluminium foil and dried under vacuum
Activationvacuum drying at 70 C for 12 h
Scalability contextElectrode composition reported, but slurry solvent and coating parameters are not specified.
Show 4 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|---|---|---|
| Other | DDA-Cu active material | 70 wt% | S2 · Electrochemical Measurements |
| Additive | Super-P | 20 wt% | S2 · Electrochemical Measurements |
| Additive | CMC/SBR binder | 10 wt%; CMC/SBR mass ratio 1:1 | S2 · Electrochemical Measurements |
| Electrolyte | LiTFSI in DOL:DME | 4 M; v:v 1:1 | S2 · Electrochemical Measurements |