Partial recipeSource: SI
Route 1: Drop Cast
19 · Section 10 · Figure S12
Metal precursorspreformed AgNC@MIL-53; Au electrodes
Linker precursorspreformed AgNC@MIL-53
Solventsethanol suspension implied by Figure S12 label Ag@MIL in ethanol
Additives0.3 mm Cu wire spacer/mask removed after sputtering
Atmospherenot reported
Temperature150 C anneal
Timeanneal time not reported
Substrate orientationglass substrate; Au electrodes sputtered around Cu wire gap
Oxidant / reductantnone during film fabrication
Work-upspread/doctor blade film on glass; annealed to remove organic residues; sputter-deposited Au electrodes; removed Cu wire
Activationannealed at 150 C to remove organic residues
Scalability contextThin-film device fabrication schematic rather than full scalable process.
Show 4 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|---|---|---|
| Other | AgNC@MIL-53 in ethanol | not reported | 19 · Section 10 · Figure S12 |
| Other | glass substrate | not reported | 19 · Section 10 · Figure S12 |
| Other | Au electrodes | not reported | 19 · Section 10 · Figure S12 |
| Other | Cu wire | 0.3 mm | 19 · Section 10 · Figure S12 |