Diffraction Structure — Surface Morphology and Electrical Properties of Cu3BTC2 Thin Films before and after Reaction with TCNQ

Measurement evidence

Diffraction Structure

Surface Morphology and Electrical Properties of Cu3BTC2 Thin Films before and after Reaction with TCNQ · Thurmer K., Schneider C., Stavila V. et al. · ACS Applied Materials and Interfaces · 2018 · 39400-39410

4 measurement groups · 11 results

Reported values remain attached to the sample, method, conditions, extraction quality and source location that produced them.

GIXRD

Cu(TCNQ) film from 20-cycle Cu3BTC2 on ITO · Thin Film

2theta 5-30 degrees; PANalytical Empyrean with Cu X-ray tube at 44 kV and 40 mA.

Atmosphere
ambient/ex situ
Geometry
20-cycle film on ITO before and after TCNQ/MeOH
Context
pristine-to-converted comparison
Measurement source
p006 / 39405 · Figure caption · Figure 6
PropertyReported valueNormalised valueUncertaintyOrigin and qualitySource
20-cycle film phase after TCNQreproduces Cu(TCNQ) Phase I pattern; no initial Cu3BTC2 reflections seenText
Qualitative
p005 / 39404 · Results and Discussion · Figure 6
20-cycle film phase before TCNQmatches the Cu3BTC2 reference structureText
Qualitative
p005 / 39404 · Results and Discussion · Figure 6
Substrate reflection in GIXRDreflection at 21.46 degrees stems from substrateCaption
Exact Reported
p006 / 39405 · Figure caption · Figure 6
Estimated enthalpy of reaction 4-3840 kJ/mol-3840000 J/molcrude estimate; Cu(TCNQ) approximated using Ag(TCNQ)Calculated From Reported
Uncertain
p007 / 39406 · Chemical Processes · eq 4

GIXRD

PCN-14 film after TCNQ/MeOH infiltration · Thin Film

PCN-14 film before and after TCNQ/MeOH infiltration; compared with PCN-14 and Cu(TCNQ) references.

Atmosphere
ex situ
Geometry
thin film
Context
supporting Cu-paddlewheel MOF conversion example
Measurement source
p003 / S-3 · Figure captions · Figure S4
PropertyReported valueNormalised valueUncertaintyOrigin and qualitySource
PCN-14 after TCNQ/MeOH GIXRD assignmentsignatures of Cu(TCNQ) phase I after infiltrationText
Qualitative
p007 / 39406 · Chemical Processes · Figure S4

PXRD

Cu3BTC2 powder after 7 days TCNQ/MeOH · Powder

Powder patterns recorded in capillary mode after TCNQ/MeOH infiltration for 3 and 7 days.

Temperature
room temperature infiltration
Atmosphere
not specified
Geometry
powder capillary PXRD
Context
partial conversion of powder grains
Measurement source
p006 / 39405 · Figure caption · Figure 7
PropertyReported valueNormalised valueUncertaintyOrigin and qualitySource
Cu(TCNQ) phase after 3 days powder infiltrationsecond phase matching Cu(TCNQ) reference formsText
Qualitative
p006 / 39405 · Partial Conversion · Figure 7
Cu3BTC2 powder conversion after 7 dayscould not be completely transformed even after 7 days168 hText
Exact Reported
p006 / 39405 · Partial Conversion · Figure 7
Activated Cu3BTC2 powder grain size10-30 um10-30 umText
Range
p006 / 39405 · Partial Conversion · Figure 7
Infiltration solution colour after 24 hyellow to green after 24 h24 hText
Exact Reported
p006 / 39405 · Partial Conversion · Figure 7
Infiltration solution colour after 7 daysbrown-orange after 7 days168 hText
Exact Reported
p006 / 39405 · Partial Conversion · Figure 7

GIXRD

Cu(TCNQ) film from 50-cycle Cu3BTC2 device · Electrode

50-cycle Cu3BTC2 film on SiO2/Si(001) before and after TCNQ/MeOH infiltration.

Atmosphere
ex situ
Geometry
SiO2/Si(001) film
Context
device-substrate phase comparison
Measurement source
p002 / S-2 · Figure captions · Figure S1
PropertyReported valueNormalised valueUncertaintyOrigin and qualitySource
50-cycle SiO2/Si film GIXRD before/after TCNQGIXRD pattern shown before and after infiltration with TCNQ in MeOHCaption
Qualitative
p002 / S-2 · Figure caption · Figure S1