Partial recipeSource: Main
Route 1: Other
268 · MOF Film Synthesis
Metal precursorsethanolic 0.1 mM copper(II) acetate solution
Linker precursorsethanolic 0.01 mM HHTP solution
Solventsethanol; pure ethanol rinse
Additives11-mercapto-1-undecanol (MUD) used to modify gold-coated silicon wafer substrates
Atmospherenot specified
Temperature60
Time20
Substrate orientationMUD-modified gold-coated silicon wafer; films grew with layers parallel to substrate and pores perpendicular to substrate surface
Work-upAlternating dips in copper acetate and HHTP solutions; 2 min pure ethanol dip to remove residual reactants; post-immersion in ethanolic 0.01 mM HHTP; surface cleaned with ethanol before use.
ActivationAnnealed in a 60 C oven for 20 h after immersion in 0.01 mM HHTP ethanol solution.
Scalability contextDipping robot layer-by-layer SURMOF method; cycle number controls thickness/channel length.
Show 5 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|---|---|---|
| Metal Source | copper(II) acetate | 0.1 mM in ethanol | 268 · MOF Film Synthesis |
| Linker | 2,3,6,7,10,11-hexahydroxytriphenylene (HHTP) | 0.01 mM in ethanol | 268 · MOF Film Synthesis |
| Solvent | ethanol | 99.5%; used for precursor solutions and rinse | 268 · MOF Film Synthesis |
| Additive | 11-mercapto-1-undecanol (MUD) | not specified | 268 · MOF Film Synthesis |
| Other | gold-coated silicon wafer | Not specified | 268 · MOF Film Synthesis |