Partial recipeSource: SI
Route 1: Solvothermal
SI p002 · Electrode Preparation · Figure S8
Metal precursorsCu(OH)2 NP-modified Cu mesh
Linker precursorsHHTP (0.02 mM)
Solventswater/DMF, v:v = 1:1
Atmosphereair / not otherwise specified
Temperature85
Time0.5
Substrate orientationCu(OH)2 NP-modified Cu mesh immersed in HHTP water/DMF solution
Oxidant / reductantCu(OH)2 nanoparticle precursor generated by APS oxidation
Work-upnot reported
Activationnot reported
Show 3 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|---|---|---|
| Metal Source | Cu(OH)2 NP-modified Cu mesh | Not specified | SI p002 · Electrode Preparation · Figure S8 |
| Linker | HHTP | 0.02 mM | SI p002 · Electrode Preparation · Figure S8 |
| Solvent | water/DMF | v:v = 1:1 | SI p002 · Electrode Preparation · Figure S8 |