Complete recipeSource: Main
Route 1: Other
2-3 · Section 2.3
Metal precursorsCu(NO3)2.3H2O (0.028 mmol)
Linker precursorsHHTP (0.023 mmol)
Solvents4 mL mixed DMF:water = 1:7
AdditivesAPTMS substrate pretreatment
Atmosphereambient/unspecified
Temperature60
Time1
Substrate orientationpre-modified substrate; orientation not specified
Work-upcleaned with water and acetone in turn and dried
Activationdried after washing
Scalability contextInkjet printing permits tailored electrode patterns, but scale-up was not quantified.
Show 4 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|---|---|---|
| Metal Source | Cu(NO3)2.3H2O (0.028 mmol) | Not specified | 2-3 · Section 2.3 |
| Linker | HHTP (0.023 mmol) | Not specified | 2-3 · Section 2.3 |
| Solvent | 4 mL mixed DMF:water = 1:7 | Not specified | 2-3 · Section 2.3 |
| Additive | APTMS substrate pretreatment | Not specified | 2-3 · Section 2.3 |