MEMS Au interdigitated electrode fabrication and SEM geometry inspection
Co1.8Ni1.2(HITP)2 chemiresistive gas sensor on Au IDE chip · Electrode
4-inch silicon wafer, Cr/Au sputtering, LC100A lithography, ion beam etching and dicing into chips.
| Property | Reported value | Normalised value | Uncertainty | Origin and quality | Source |
|---|---|---|---|---|---|
| bare chip dimensions | 3 x 4.5 mm2 | — | — | Text Exact Reported | 4 · 2.2. Chip Design and Fabrication · Figure 3b |
| Cr/Au thickness | 30/100 nm | — | — | Text Exact Reported | 3 · Au IDEs fabrication · Figure S13 |
| number of Cr/Au line pairs | 50 pairs | — | — | Text Exact Reported | 4 · Au IDEs fabrication · Figure S13 |
| IDE finger electrode spacing | 10 um | — | — | Text Exact Reported | 4 · 2.2. Chip Design and Fabrication · Figure 3d |
| IDE finger electrode width | 10 um | — | — | Text Exact Reported | 4 · 2.2. Chip Design and Fabrication · Figure 3d |