Cyclic voltammetry on Au/SiO2 electrode before Cu deposition
Cu3(HHTP)2@Au/SiO2 as-deposited film · Thin Film
0.01 M CuSO4 and 0.1 M KCl, SCE reference, Pt counter; scan rate 120 mV s-1; electrode area 1 cm2
| Property | Reported value | Normalised value | Uncertainty | Origin and quality | Source |
|---|---|---|---|---|---|
| Cu0 to Cu+ oxidation peak | +0.214 V vs SCE | — | — | Text Exact Reported | 11 · Anodic Electrosynthesis of Cu3(HHTP)2 onto Au/SiO2 substrates · Figure S9 |
| Cu+ to Cu2+ oxidation peak | +0.362 V vs SCE | — | — | Text Exact Reported | 11 · Anodic Electrosynthesis of Cu3(HHTP)2 onto Au/SiO2 substrates · Figure S9 |
| Cu reduction peak on Au/SiO2 | -0.240 V vs SCE | — | — | Text Exact Reported | 11 · Anodic Electrosynthesis of Cu3(HHTP)2 onto Au/SiO2 substrates · Figure S9 |