Diffraction Structure — Chemical Vapor Deposition and High-Resolution Patterning of a Highly Conductive Two-Dimensional Coordination Polymer Film

4 measurement groups · 12 results

Reported values remain attached to the sample, method, conditions, extraction quality and source location that produced them.

20 nm CVD Cu-BHT nanofilm · Thin Film

Elettra XRD1 beamline; wavelength 1.4 A, incident angle ca. 0.5 deg.

Geometry: oriented thin film
Context: pristine Cu-BHT CVD film
Measurement source: main p.3 / article p.C · Results and Discussion · Figure 2e; Figure S9

Property	Reported value	Normalised value	Uncertainty	Origin and quality	Source
No CuO peaks up to 85 nm Cu-BHT film	absence of CuO peaks for Cu-BHT films up to 85 nm	—	—	Text Qualitative	main p.3 / article p.C · Results and Discussion · Figure S9
Unreacted CuO ring for 40 nm CuO precursor conversion	characteristic diffraction ring for polycrystalline CuO	—	—	Text Qualitative	main p.3 / article p.C · Results and Discussion · Figure S9
Crystalline Cu-BHT formation by 2D-GIXRD	crystalline Cu-BHT, AA stacking, monoclinic C2	—	—	Text Qualitative	main p.2-p.3 / article p.B-C · Results and Discussion · Figure 2e
Cu-BHT lattice parameter a	a = 15.016 A	—	—	Text Exact Reported	main p.2 / article p.B · Results and Discussion · Figure 2e
Cu-BHT lattice parameter b	b = 8.691 A	—	—	Text Exact Reported	main p.2 / article p.B · Results and Discussion · Figure 2e
Cu-BHT lattice beta angle	beta = 101.501 deg	—	—	Text Exact Reported	main p.2 / article p.B · Results and Discussion · Figure 2e
Cu-BHT lattice parameter c	c = 3.489 A	—	—	Text Exact Reported	main p.2 / article p.B · Results and Discussion · Figure 2e
Preferred crystallite orientation	2D ab planes parallel to the substrate; 001 reflection only out-of-plane	—	—	Text Qualitative	main p.2 / article p.B · Results and Discussion · Figure 2e

Bottom-up lift-off patterned CVD Cu-BHT features · Thin Film

DESY P23 beamline; beam focused to 1 x 3.5 um2; incident angle ca. 0.15 deg.

Geometry: 3 um Cu-BHT lines spaced 20 um apart
Context: pristine patterned Cu-BHT lines
Measurement source: main p.5 / article p.E · Results and Discussion · Figure 3d; Figure S14

Property	Reported value	Normalised value	Uncertainty	Origin and quality	Source
Cu-BHT line spacing by micro-XRD intensity	20 um separation	20000 nm	—	Text Rounded Reported	main p.5 / article p.E · Results and Discussion · Figure 3d; Figure S14
Cu-BHT line width for micro-XRD crystallinity check	3 um lines	3000 nm	—	Text Rounded Reported	main p.5 / article p.E · Results and Discussion · Figure 3d

Top-down Ar plasma etched Cu-BHT line patterns · Thin Film

Top-down Ar plasma etching lithography; micro-XRD scans across line patterns.

Geometry: 3 um Cu-BHT lines spaced 20 um apart
Context: plasma-processed Cu-BHT films
Measurement source: main p.5 / article p.E · Results and Discussion · Figures S15-S16

Property	Reported value	Normalised value	Uncertainty	Origin and quality	Source
Plasma-etched pattern edge damage	damage at the line edges	—	—	Text Qualitative	main p.5 / article p.E · Results and Discussion · Figure S16
Incomplete Cu-BHT removal after plasma etching	001 peak remained observable between lines	—	—	Text Qualitative	main p.5 / article p.E · Results and Discussion · Figure S15b-c

Solvent-free Cu-BHT powder product · Powder

PXRD in transmission mode over 1.2 deg < 2theta < 45 deg; SEM at 10 keV after 2 nm Pt coating.

Geometry: powder
Context: pristine framework powder
Measurement source: SI p.S5 and p.S9 · Powder X-ray diffraction; Scanning electron microscopy · Figures S3-S4

Property	Reported value	Normalised value	Uncertainty	Origin and quality	Source