Complete recipeSource: SI
Route 1: Other
S2-S3 · Preparation of Nickel Foam (NF) Electrodes
Metal precursorsNickel foam, >=99.8% Ni
Solventsacid etching solution; degassed water rinse
Additives5 mL glacial acetic acid, 3 mL concentrated nitric acid, 1 mL concentrated phosphoric acid, 1 mL concentrated sulfuric acid
Atmospheredegassed water rinse; used immediately
Temperatureroom temperature not explicitly stated
Time0.0167
Substrate orientationNF cut into 1.5 x 0.5 cm strips; 0.5 x 0.5 cm geometric area submerged for electrosynthesis.
Oxidant / reductantacid etching removes native metal oxide layer
Work-upRinsed with degassed water and used immediately.
Activationacid etch before electrochemistry/electrosynthesis
Scalability contextControl substrate preparation; insufficient etching can cause passivation and failure.
Show 5 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|---|---|---|
| Metal Source | nickel foam | 1.5 x 0.5 cm strips · >=99.8% Ni | S2-S3 · Preparation of Nickel Foam (NF) Electrodes |
| Acid | glacial acetic acid | 5 mL | S2-S3 · Preparation of Nickel Foam (NF) Electrodes |
| Acid | concentrated nitric acid | 3 mL · concentrated | S2-S3 · Preparation of Nickel Foam (NF) Electrodes |
| Acid | concentrated phosphoric acid | 1 mL · concentrated | S2-S3 · Preparation of Nickel Foam (NF) Electrodes |
| Acid | concentrated sulfuric acid | 1 mL · concentrated | S2-S3 · Preparation of Nickel Foam (NF) Electrodes |