Synthesis evidence

Electrosynthesis of a Nickel-Based Conductive Metal-Organic Framework with Controlled Morphology for Enhanced Capacitance

Stodolka M., Choi J.Y., Fang X. et al. · ACS Materials Letters · 2024 · 49-55

5 structured synthesis routes

Completeness describes how fully the route could be reconstructed from the main article and supporting information.

Complete recipeSource: SI

Route 1: Other

S2-S3 · Preparation of Nickel Foam (NF) Electrodes

Metal precursorsNickel foam, >=99.8% Ni
Solventsacid etching solution; degassed water rinse
Additives5 mL glacial acetic acid, 3 mL concentrated nitric acid, 1 mL concentrated phosphoric acid, 1 mL concentrated sulfuric acid
Atmospheredegassed water rinse; used immediately
Temperatureroom temperature not explicitly stated
Time0.0167
Substrate orientationNF cut into 1.5 x 0.5 cm strips; 0.5 x 0.5 cm geometric area submerged for electrosynthesis.
Oxidant / reductantacid etching removes native metal oxide layer
Work-upRinsed with degassed water and used immediately.
Activationacid etch before electrochemistry/electrosynthesis
Scalability contextControl substrate preparation; insufficient etching can cause passivation and failure.
Show 5 structured reagent records
RoleReagentAmount / concentrationSource
Metal Sourcenickel foam1.5 x 0.5 cm strips · >=99.8% NiS2-S3 · Preparation of Nickel Foam (NF) Electrodes
Acidglacial acetic acid5 mLS2-S3 · Preparation of Nickel Foam (NF) Electrodes
Acidconcentrated nitric acid3 mL · concentratedS2-S3 · Preparation of Nickel Foam (NF) Electrodes
Acidconcentrated phosphoric acid1 mL · concentratedS2-S3 · Preparation of Nickel Foam (NF) Electrodes
Acidconcentrated sulfuric acid1 mL · concentratedS2-S3 · Preparation of Nickel Foam (NF) Electrodes
Complete recipeSource: SI

Route 2: Drop Cast

S3 · Bulk Ni-HHTP@NF Preparation

Metal precursorsBulk Ni-HHTP powder containing Ni nodes; pre-etched NF substrate.
Linker precursorsHHTP already incorporated in bulk Ni-HHTP powder.
Solvents75 uL ethanol
Additives0.4 mg Super P activated carbon; 6 uL of 5 wt% PTFE binder.
Atmospherenot reported
Temperature65
Time1
Substrate orientation20 uL ink injected into pre-etched NF electrode.
Oxidant / reductantnone reported
Work-upDried at 65 deg C for 1 h prior to use.
ActivationDrying at 65 deg C for 1 h.
Scalability contextComposite ink electrode prepared only as control; authors note binders/additives can obscure intrinsic MOF performance.
Show 5 structured reagent records
RoleReagentAmount / concentrationSource
Otherbulk Ni-HHTP0.8 mgS3 · Bulk Ni-HHTP@NF Preparation
AdditiveSuper P activated carbon0.4 mgS3 · Bulk Ni-HHTP@NF Preparation
AdditivePTFE6 uL · 5 wt%S3 · Bulk Ni-HHTP@NF Preparation
Solventethanol75 uLS3 · Bulk Ni-HHTP@NF Preparation
Otherink aliquot20 uL injectedS3 · Bulk Ni-HHTP@NF Preparation
Complete recipeSource: SI

Route 3: Solvothermal

S3 · Preparation of Bulk Ni-HHTP Powder

Metal precursorsNi(OAc)2 x 4 H2O, 10 mg
Linker precursorsHHTP, 7 mg
Solvents4 mL water
Additivesnone reported
Atmospherenot reported
Temperature85
Time12
Substrate orientation20 mL glass vial; no substrate.
Oxidant / reductantnone reported in bulk synthesis recipe
Work-upNavy-blue powder washed twice with water (10 mL) and twice with acetone (10 mL).
ActivationDried under vacuum at 60 deg C for 1 h.
Scalability contextPrepared as bulk powder control; no scale-up discussed.
Show 3 structured reagent records
RoleReagentAmount / concentrationSource
Metal SourceNi(OAc)2 x 4 H2O10 mgS3 · Preparation of Bulk Ni-HHTP Powder
LinkerHHTP7 mgS3 · Preparation of Bulk Ni-HHTP Powder
Solventwater4 mLS3 · Preparation of Bulk Ni-HHTP Powder
Partial recipeSource: Both

Route 4: Electrochemical

51 · Results · Figure 2

Metal precursorsNickel foam working electrode/anode supplies Ni2+ by anodic dissolution.
Linker precursors5 mg reduced HHTP gives the disc morphology in 22 mL electrolyte; HHTP was reduced before use.
Solvents22 mL aqueous electrolyte; same electrosynthesis platform as flower route.
AdditivesKCl electrolyte and ammonium hydroxide base as in the optimised electrosynthesis; exact SI recipe is only fully written for the 3 mg flower condition.
AtmosphereElectrolyte nitrogen purge and HHTP nitrogen/glovebox handling as in SI general procedure.
Temperatureroom temperature not explicitly stated for electrosynthesis; electrodes dried at 65 deg C.
Time2
Substrate orientationThree-electrode cell with NF anode, Pt counter/cathode and Ag/AgCl reference; Figure 2 time-course marks +0.25 V.
Oxidant / reductantApplied potential +0.25 V vs Ag/AgCl in Figure 2; sodium hydrosulfite used to reduce HHTP before use.
Work-upSame electrode drying and detached-powder washing/drying methods as flower route when used for electrochemistry and characterisation.
ActivationDried at 65 deg C for 2 h for electrosynthesised electrodes; detached solid dried under vacuum at 60 deg C for 1 h.
Scalability contextDisc morphology is controlled by higher HHTP concentration; exceeding 5 mg HHTP causes adhesion loss rather than greater coverage.
Show 5 structured reagent records
RoleReagentAmount / concentrationSource
Metal Sourcenickel foam (NF) working electrode/anode0.5 x 0.5 cm cross-section exposed in general procedure · >=99.8% Ni51 · Results · Figure 2
LinkerHHTP5 mg · in 22 mL electrolyte51 · Results · Figure 2
ElectrolyteKCl aqueous electrolyte22 mL in concentration screen · 1.17 mM in base electrosynthesis recipe51 · Results · Figure 2
Baseammonium hydroxide7.25 equiv in base electrosynthesis recipe · 1 M in base electrosynthesis recipe51 · Results · Figure 2
Reductantsodium hydrosulfite for HHTP pre-reduction7.68 g per 584 mg HHTP precursor batch51 · Results · Figure 2
Complete recipeSource: Both

Route 5: Electrochemical

S3-S4 · Electrosynthesis of Ni-HHTP

Metal precursorsNickel foam working electrode/anode supplies Ni2+ by anodic dissolution; NF was >=99.8% Ni.
Linker precursors3 mg reduced HHTP; HHTP precursor was reduced from partially oxidised HHTP using sodium hydrosulfite before use.
Solvents22 mL deionized water electrolyte; HHTP pre-reduction used degassed 1:1 THF:water and ethyl acetate extraction.
Additives1.75 mg KCl; 86.2 uL (7.25 equiv) of 1 M ammonium hydroxide; NF acid etch used glacial acetic acid, concentrated nitric acid, concentrated phosphoric acid and concentrated sulfuric acid.
AtmosphereElectrolyte purged with nitrogen for 15 min; reduced HHTP stored in glovebox under nitrogen.
Temperatureroom temperature for electrosynthesis; electrodes dried at 65 deg C; detached solids dried at 60 deg C under vacuum where used for BET/XPS/EDS.
Time2
Substrate orientationThree-electrode cell: NF working electrode/anode clamped in PTFE holder with Pt contact, Pt counter electrode/cathode, Ag/AgCl reference; 0.5 x 0.5 cm NF cross-section exposed; gentle stirring at 60 RPM.
Oxidant / reductantApplied +0.25 V vs Ag/AgCl for anodic Ni dissolution; sodium hydrosulfite used to reduce HHTP precursor.
Work-upFor electrodes: dried 2 h at 65 deg C, rinsed with deionized water then acetonitrile. For detached powders: sonicated in water 3 min, centrifuged at 6000 RPM for 5 min, washed twice with water and twice with acetone, dried 1 h at 60 deg C under vacuum.
ActivationGentle drying at 65 deg C for 2 h before XRD or BET in the general procedure; vacuum drying at 60 deg C for 1 h after detachment.
Scalability contextMain text presents electrosynthesis as scalable and directly grown on targeted substrates, but no scale-up experiment is reported.
Show 8 structured reagent records
RoleReagentAmount / concentrationSource
Metal Sourcenickel foam (NF) working electrode/anode1.5 x 0.5 cm strip; 0.5 x 0.5 cm exposed · >=99.8% NiS3-S4 · Electrosynthesis of Ni-HHTP
Linker2,3,6,7,10,11-hexahydroxytriphenylene (HHTP)3 mgS3-S4 · Electrosynthesis of Ni-HHTP
ElectrolyteKCl1.75 mg in 22 mL water · 1.17 mM in main textS3-S4 · Electrosynthesis of Ni-HHTP
Baseammonium hydroxide86.2 uL; 7.25 equiv · 1 MS3-S4 · Electrosynthesis of Ni-HHTP
Acidglacial acetic acid/nitric acid/phosphoric acid/sulfuric acid etch5 mL / 3 mL / 1 mL / 1 mL for 60 s · concentrated nitric, phosphoric and sulfuric acidsS3-S4 · Electrosynthesis of Ni-HHTP
Reductantsodium hydrosulfite for HHTP pre-reduction7.68 g; 27 eqS3-S4 · Electrosynthesis of Ni-HHTP
Solventdegassed 1:1 THF:water for HHTP reduction40 mLS3-S4 · Electrosynthesis of Ni-HHTP
Solventethyl acetate extraction solvent2 x 80 mLS3-S4 · Electrosynthesis of Ni-HHTP