Microcrystal electron diffraction (Micro-ED) in TEM
Pulverised Cu3BHT powder for Micro-ED · Powder
JEOL JEM2100 TEM at 200 kV with Timepix detector; specimen cooled to 96 K; goniometer rotation; 0.5 s exposures.
| Property | Reported value | Normalised value | Uncertainty | Origin and quality | Source |
|---|---|---|---|---|---|
| Interlayer Cu-S covalent contactMarked as a best value within this paper | 2.662(6) Angstrom | — | (6) | Text Exact Reported | 3 · Single crystal structure characterization of Cu3BHT · Figure 1b,c |
| Cu-S coordination bond distance range | 2.26(1) to 2.33(9) Angstrom | — | range with reported uncertainties | Text Range | 2 · Single crystal structure characterization of Cu3BHT · Supplementary Fig. 10 |
| Average interlayer distance | 3.32 Angstrom | — | — | Text Rounded Reported | 3 · Single crystal structure characterization of Cu3BHT · Figure 1b |
| Micro-ED unit-cell volume | 870.6(3) Angstrom3 | — | (3) | Table Exact Reported | 29 · Supplementary Table 1 · Supplementary Table 1 |
| Micro-ED resolutionMarked as a best value within this paper | 0.696 Angstrom | — | — | Text Exact Reported | 2 · Single crystal structure characterization of Cu3BHT · Figure 1f |