Partial recipeSource: SI
Route 1: Other
6 · Fabrication of ITO/NMOF-1/Al and ITO/H2OPE-C12/AlSchottky diode · Figure S21
Metal precursorsAl rectifier metal contact; ITO substrate
Linker precursorsH2OPE-C12 material
Solventsethanol medium for dispersion; soap solution, acetone, ethanol and distilled water for ITO cleaning
Additivesnone reported
Atmospherenot reported; thermal evaporation for Al contact
Temperatureroom temperature for coating; Al deposited by thermal evaporation
Timespin coating for 2 min
Substrate orientationITO-coated glass; Al top contact through shadow mask
Oxidant / reductantnone
Work-upsame spin-coating and Al evaporation procedure as NMOF-1 SBD device
Activationnot reported
Scalability contexteffective diode area 7.065 x 10^-6 m2 maintained by shadow mask
Show 4 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|---|---|---|
| Linker | H2OPE-C12 | not reported | 6 · Fabrication of ITO/NMOF-1/Al and ITO/H2OPE-C12/AlSchottky diode · Figure S21 |
| Solvent | ethanol | not reported | 6 · Fabrication of ITO/NMOF-1/Al and ITO/H2OPE-C12/AlSchottky diode · Figure S21 |
| Other | ITO coated glass substrate | Not specified | 6 · Fabrication of ITO/NMOF-1/Al and ITO/H2OPE-C12/AlSchottky diode · Figure S21 |
| Other | Aluminium rectifier metal contact | not reported | 6 · Fabrication of ITO/NMOF-1/Al and ITO/H2OPE-C12/AlSchottky diode · Figure S21 |