Diffraction Structure — Three-type precursors for low-temperature solution-processed void-and-crack-free copper(I) iodide films: comparison of electrical conductivities and optical transparency

Measurement evidence

Diffraction Structure

Three-type precursors for low-temperature solution-processed void-and-crack-free copper(I) iodide films: comparison of electrical conductivities and optical transparency · Ishizaki M., Koya N., Gotoh Y. et al. · Bulletin of the Chemical Society of Japan · 2024 · uoae071

1 measurement group · 1 results

Reported values remain attached to the sample, method, conditions, extraction quality and source location that produced them.

Powder X-ray diffraction using Rigaku MiniFlex II with Cu K alpha 1 radiation

X-ray diffraction and scattering

CuI(1A2P) film on glass · Thin Film

CuI films from AN/DES (0.13 M) and 2AE/1A2P (0.26 M) after heating at various temperatures; gamma-CuI reference no. 01-070-2453.

Geometry: thin film on glass
Context: Pristine CuI thin films from different precursors.
Measurement source: 3 · 2.4 Characterization

Property	Reported value	Normalised value	Uncertainty	Origin and quality	Source
CuI-2AM1P did not decompose to CuI at 150 deg C	did not thermally decompose to CuI at 150 deg C	—	—	Text Qualitative	7 · Conclusion