Synthesis · Conductive metal-organic framework synthesis from metal nanoparticle precursors

14 structured synthesis routes

Completeness describes how fully the route could be reconstructed from the main article and supporting information.

Partial recipeSource: Main

Route 1: Other

p005 · Characterisation techniques

Metal precursorspure bulk Cu metal submerged in alkaline ligand/electrolyte solution

Linker precursorsHATP.6HCl ligand

Solventsethanol/water ligand solution

Additivesammonia solution and TBMAMS electrolyte

Atmospherenot stated; air drying/drop-casting after dispersion

Temperatureroom temperature implied

Timenot stated

Substrate orientationbulk Cu metal surface

Oxidant / reductantmetal hydroxide intermediate and dissolved oxygen proposed for standard route

Work-upMOF scraped off metal surface, dispersed in ethanol, drop-cast onto Cu TEM grids with holey carbon film.

ActivationNone reported.

Scalability contextBulk metal route supplied TEM powder for lattice imaging.

Show 3 structured reagent records

Role	Reagent	Amount / concentration	Source
Metal Source	pure bulk Cu metal	not stated	p005 · Characterisation techniques
Linker	HATP.6HCl ligand solution	not stated	p005 · Characterisation techniques
Solvent	ethanol for dispersion	not stated	p005 · Characterisation techniques

Partial recipeSource: Both

Route 2: Other

p003-p004 · Materials synthesis · Figure 2

Metal precursorsCu nanoparticles deposited onto substrate by dc magnetron plasma sputtering source (NL50, Nikalyte Ltd.); 8000 ng cm-2 on cotton

Linker precursorsHATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)

Solvents4 ml ethanol + 1 ml water per vial (4:1 ethanol/water)

Additives375 ul 19.4 M ammonia solution; 0.10 mmol TBMAMS electrolyte

AtmosphereAir exposure during drying; dissolved oxygen participates in proposed ligand oxidation; no inert atmosphere reported.

Temperatureroom temperature

Time1

Substrate orientation200 thread count cotton percale

Oxidant / reductantDissolved oxygen proposed to oxidise partially deprotonated ligand radical; metal hydroxide intermediate proposed.

Work-upSolution pipetted off; substrate left to dry at room temperature in air overnight.

ActivationNone reported beyond drying in air overnight.

Scalability contextAuthors state any substrate fitting inside the sputtering chamber can be used and that the mild, salt-free, room-temperature route is potentially scalable.

Show 6 structured reagent records

Role	Reagent	Amount / concentration	Source
Metal Source	Cu nanoparticles deposited by dc magnetron plasma sputtering source	7000 ng cm-2 on Au(111); 8000 ng cm-2 on cotton; 5000 ng cm-2 on paper; 7000 ng cm-2 on Pt IDEs	p003-p004 · Materials synthesis · Figure 2
Linker	HATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)	5 ml total ligand solution per vial · 2 mM	p003-p004 · Materials synthesis · Figure 2
Solvent	ethanol	4 ml	p003-p004 · Materials synthesis · Figure 2
Solvent	water	1 ml	p003-p004 · Materials synthesis · Figure 2
Base	ammonia solution (Fisher Scientific UK)	375 ul · 19.4 M	p003-p004 · Materials synthesis · Figure 2
Electrolyte	tributylmethylammonium methyl sulphate (TBMAMS, 97%)	0.10 mmol	p003-p004 · Materials synthesis · Figure 2

Partial recipeSource: Main

Route 3: Other

p006 · Results and discussion · Figure 3d

Metal precursorsCopper foil used instead of nanoparticles as the Cu source

Linker precursorsHATP.6HCl ligand; same alkaline ligand/electrolyte solution as nanoparticle route implied

Solventsethanol/water ligand solution

Additivesammonia solution and TBMAMS electrolyte implied by same synthesis method

Atmosphereair drying after removal from solution

Temperatureroom temperature

Timenot explicitly stated for foil scale-up

Substrate orientationcopper foil scale-up substrate

Oxidant / reductantCu(OH)2 intermediate proposed; CuO side-product assigned after drying

Work-upPowder scraped off copper foil for PXRD.

ActivationNone reported.

Scalability contextScale-up generated enough Cu MOF powder for PXRD.

Show 4 structured reagent records

Role	Reagent	Amount / concentration	Source
Metal Source	copper foil	not stated	p006 · Results and discussion · Figure 3d
Linker	HATP.6HCl ligand solution	not stated for scale-up · 2 mM in standard route, implied	p006 · Results and discussion · Figure 3d
Base	ammonia solution	not stated for scale-up · 19.4 M in standard route, implied	p006 · Results and discussion · Figure 3d
Electrolyte	TBMAMS	not stated for scale-up	p006 · Results and discussion · Figure 3d

Partial recipeSource: Both

Route 4: Other

p003-p004 · Materials synthesis · Figure 2

Metal precursorsCu nanoparticles deposited onto substrate by dc magnetron plasma sputtering source (NL50, Nikalyte Ltd.); 7000 ng cm-2 on Pt IDEs

Linker precursorsHATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)

Solvents4 ml ethanol + 1 ml water per vial (4:1 ethanol/water)

Additives375 ul 19.4 M ammonia solution; 0.10 mmol TBMAMS electrolyte

AtmosphereAir exposure during drying; dissolved oxygen participates in proposed ligand oxidation; no inert atmosphere reported.

Temperatureroom temperature

Time1

Substrate orientationPt/glass IDE with 5 um gaps

Oxidant / reductantDissolved oxygen proposed to oxidise partially deprotonated ligand radical; metal hydroxide intermediate proposed.

Work-upSolution pipetted off; substrate left to dry at room temperature in air overnight.

ActivationNone reported beyond drying in air overnight.

Scalability contextAuthors state any substrate fitting inside the sputtering chamber can be used and that the mild, salt-free, room-temperature route is potentially scalable.

Show 6 structured reagent records

Role	Reagent	Amount / concentration	Source
Metal Source	Cu nanoparticles deposited by dc magnetron plasma sputtering source	7000 ng cm-2 on Au(111); 8000 ng cm-2 on cotton; 5000 ng cm-2 on paper; 7000 ng cm-2 on Pt IDEs	p003-p004 · Materials synthesis · Figure 2
Linker	HATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)	5 ml total ligand solution per vial · 2 mM	p003-p004 · Materials synthesis · Figure 2
Solvent	ethanol	4 ml	p003-p004 · Materials synthesis · Figure 2
Solvent	water	1 ml	p003-p004 · Materials synthesis · Figure 2
Base	ammonia solution (Fisher Scientific UK)	375 ul · 19.4 M	p003-p004 · Materials synthesis · Figure 2
Electrolyte	tributylmethylammonium methyl sulphate (TBMAMS, 97%)	0.10 mmol	p003-p004 · Materials synthesis · Figure 2

Partial recipeSource: Both

Route 5: Other

p003-p004 · Materials synthesis · Figure 2

Metal precursorsCu nanoparticles deposited onto substrate by dc magnetron plasma sputtering source (NL50, Nikalyte Ltd.); 7000 ng cm-2 on Au(111)

Linker precursorsHATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)

Solvents4 ml ethanol + 1 ml water per vial (4:1 ethanol/water)

Additives375 ul 19.4 M ammonia solution; 0.10 mmol TBMAMS electrolyte

AtmosphereAir exposure during drying; dissolved oxygen participates in proposed ligand oxidation; no inert atmosphere reported.

Temperatureroom temperature

Time1

Substrate orientation300 nm Au(111) film on mica

Oxidant / reductantDissolved oxygen proposed to oxidise partially deprotonated ligand radical; metal hydroxide intermediate proposed.

Work-upSolution pipetted off; substrate left to dry at room temperature in air overnight.

ActivationNone reported beyond drying in air overnight.

Scalability contextAuthors state any substrate fitting inside the sputtering chamber can be used and that the mild, salt-free, room-temperature route is potentially scalable.

Show 6 structured reagent records

Role	Reagent	Amount / concentration	Source
Metal Source	Cu nanoparticles deposited by dc magnetron plasma sputtering source	7000 ng cm-2 on Au(111); 8000 ng cm-2 on cotton; 5000 ng cm-2 on paper; 7000 ng cm-2 on Pt IDEs	p003-p004 · Materials synthesis · Figure 2
Linker	HATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)	5 ml total ligand solution per vial · 2 mM	p003-p004 · Materials synthesis · Figure 2
Solvent	ethanol	4 ml	p003-p004 · Materials synthesis · Figure 2
Solvent	water	1 ml	p003-p004 · Materials synthesis · Figure 2
Base	ammonia solution (Fisher Scientific UK)	375 ul · 19.4 M	p003-p004 · Materials synthesis · Figure 2
Electrolyte	tributylmethylammonium methyl sulphate (TBMAMS, 97%)	0.10 mmol	p003-p004 · Materials synthesis · Figure 2

Partial recipeSource: Both

Route 6: Other

p003-p004 · Materials synthesis · Figure 2

Metal precursorsCu nanoparticles deposited onto substrate by dc magnetron plasma sputtering source (NL50, Nikalyte Ltd.); 5000 ng cm-2 on paper

Linker precursorsHATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)

Solvents4 ml ethanol + 1 ml water per vial (4:1 ethanol/water)

Additives375 ul 19.4 M ammonia solution; 0.10 mmol TBMAMS electrolyte

AtmosphereAir exposure during drying; dissolved oxygen participates in proposed ligand oxidation; no inert atmosphere reported.

Temperatureroom temperature

Time24

Substrate orientationwhite paper card later contacted with silver dag

Oxidant / reductantDissolved oxygen proposed to oxidise partially deprotonated ligand radical; metal hydroxide intermediate proposed.

Work-upSolution pipetted off; substrate left to dry at room temperature in air overnight.

ActivationNone reported beyond drying in air overnight.

Scalability contextAuthors state any substrate fitting inside the sputtering chamber can be used and that the mild, salt-free, room-temperature route is potentially scalable.

Show 6 structured reagent records

Role	Reagent	Amount / concentration	Source
Metal Source	Cu nanoparticles deposited by dc magnetron plasma sputtering source	7000 ng cm-2 on Au(111); 8000 ng cm-2 on cotton; 5000 ng cm-2 on paper; 7000 ng cm-2 on Pt IDEs	p003-p004 · Materials synthesis · Figure 2
Linker	HATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)	5 ml total ligand solution per vial · 2 mM	p003-p004 · Materials synthesis · Figure 2
Solvent	ethanol	4 ml	p003-p004 · Materials synthesis · Figure 2
Solvent	water	1 ml	p003-p004 · Materials synthesis · Figure 2
Base	ammonia solution (Fisher Scientific UK)	375 ul · 19.4 M	p003-p004 · Materials synthesis · Figure 2
Electrolyte	tributylmethylammonium methyl sulphate (TBMAMS, 97%)	0.10 mmol	p003-p004 · Materials synthesis · Figure 2

Partial recipeSource: SI

Route 7: Other

p018 · Method Development · Figure S20

Metal precursorsCu nanoparticles on 1 cm by 1 cm paper pieces; 7000 ng cm-2

Linker precursorsHATP in 4:1 ethanol:DI water

Solvents4:1 by volume ethanol to DI water, 5 cm3 solution

Additives375 ul of 19.4 M ammonia solution; no TBMAMS electrolyte

Atmosphereroom-temperature drying overnight; no inert atmosphere reported

Temperatureroom temperature

Time3

Substrate orientation1 cm by 1 cm Cu-decorated paper pieces

Oxidant / reductantNo electrolyte; ammonium hydroxide removes coordinated HCl and HATP crystallises out according to authors.

Work-upRemoved after 3 h and allowed to dry overnight at room temperature.

ActivationNone reported.

Scalability contextControl shows electrolyte is required to suppress large ligand crystals and promote desired MOF formation.

Show 4 structured reagent records

Role	Reagent	Amount / concentration	Source
Metal Source	Cu nanoparticles on paper	7000 ng cm-2; 1 cm by 1 cm pieces	p018 · Method Development · Figure S20
Linker	HATP	5 cm3 solution · 2 mM	p018 · Method Development · Figure S20
Solvent	ethanol:DI water 4:1 by volume	5 cm3 total	p018 · Method Development · Figure S20
Base	ammonia solution	375 ul · 19.4 M	p018 · Method Development · Figure S20

Partial recipeSource: Both

Route 8: Other

p003-p004 · Materials synthesis · Figure 2

Metal precursorsCu nanoparticles deposited onto substrate by dc magnetron plasma sputtering source (NL50, Nikalyte Ltd.); 5000 ng cm-2 on paper

Linker precursorsHATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)

Solvents4 ml ethanol + 1 ml water per vial (4:1 ethanol/water)

Additives375 ul 19.4 M ammonia solution; 0.10 mmol TBMAMS electrolyte

AtmosphereAir exposure during drying; dissolved oxygen participates in proposed ligand oxidation; no inert atmosphere reported.

Temperatureroom temperature

Time0.0167-24

Substrate orientationwhite paper card

Oxidant / reductantDissolved oxygen proposed to oxidise partially deprotonated ligand radical; metal hydroxide intermediate proposed.

Work-upSolution pipetted off; substrate left to dry at room temperature in air overnight.

ActivationNone reported beyond drying in air overnight.

Scalability contextAuthors state any substrate fitting inside the sputtering chamber can be used and that the mild, salt-free, room-temperature route is potentially scalable.

Show 6 structured reagent records

Role	Reagent	Amount / concentration	Source
Metal Source	Cu nanoparticles deposited by dc magnetron plasma sputtering source	7000 ng cm-2 on Au(111); 8000 ng cm-2 on cotton; 5000 ng cm-2 on paper; 7000 ng cm-2 on Pt IDEs	p003-p004 · Materials synthesis · Figure 2
Linker	HATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)	5 ml total ligand solution per vial · 2 mM	p003-p004 · Materials synthesis · Figure 2
Solvent	ethanol	4 ml	p003-p004 · Materials synthesis · Figure 2
Solvent	water	1 ml	p003-p004 · Materials synthesis · Figure 2
Base	ammonia solution (Fisher Scientific UK)	375 ul · 19.4 M	p003-p004 · Materials synthesis · Figure 2
Electrolyte	tributylmethylammonium methyl sulphate (TBMAMS, 97%)	0.10 mmol	p003-p004 · Materials synthesis · Figure 2

Partial recipeSource: Main

Route 9: Other

p005 · Characterisation techniques

Metal precursorspure bulk Ni metal submerged in alkaline ligand/electrolyte solution

Linker precursorsHATP.6HCl ligand

Solventsethanol/water ligand solution

Additivesammonia solution and TBMAMS electrolyte

Atmospherenot stated; air drying/drop-casting after dispersion

Temperatureroom temperature implied

Timenot stated

Substrate orientationbulk Ni metal surface

Oxidant / reductantmetal hydroxide intermediate and dissolved oxygen proposed for standard route

Work-upMOF scraped off metal surface, dispersed in ethanol, drop-cast onto Cu TEM grids with holey carbon film.

ActivationNone reported.

Scalability contextBulk metal route supplied TEM powder because Ni PXRD material was insufficient.

Show 3 structured reagent records

Role	Reagent	Amount / concentration	Source
Metal Source	pure bulk Ni metal	not stated	p005 · Characterisation techniques
Linker	HATP.6HCl ligand solution	not stated	p005 · Characterisation techniques
Solvent	ethanol for dispersion	not stated	p005 · Characterisation techniques

Partial recipeSource: Both

Route 10: Other

p003-p004 · Materials synthesis · Figure 2

Metal precursorsNi nanoparticles deposited onto substrate by dc magnetron plasma sputtering source (NL50, Nikalyte Ltd.); 8000 ng cm-2 on cotton

Linker precursorsHATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)

Solvents4 ml ethanol + 1 ml water per vial (4:1 ethanol/water)

Additives375 ul 19.4 M ammonia solution; 0.10 mmol TBMAMS electrolyte

AtmosphereAir exposure during drying; dissolved oxygen participates in proposed ligand oxidation; no inert atmosphere reported.

Temperatureroom temperature

Time1

Substrate orientation200 thread count cotton percale

Oxidant / reductantDissolved oxygen proposed to oxidise partially deprotonated ligand radical; metal hydroxide intermediate proposed.

Work-upSolution pipetted off; substrate left to dry at room temperature in air overnight.

ActivationNone reported beyond drying in air overnight.

Scalability contextAuthors state any substrate fitting inside the sputtering chamber can be used and that the mild, salt-free, room-temperature route is potentially scalable.

Show 6 structured reagent records

Role	Reagent	Amount / concentration	Source
Metal Source	Ni nanoparticles deposited by dc magnetron plasma sputtering source	7000 ng cm-2 on Au(111); 8000 ng cm-2 on cotton; 5000 ng cm-2 on paper; 7000 ng cm-2 on Pt IDEs	p003-p004 · Materials synthesis · Figure 2
Linker	HATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)	5 ml total ligand solution per vial · 2 mM	p003-p004 · Materials synthesis · Figure 2
Solvent	ethanol	4 ml	p003-p004 · Materials synthesis · Figure 2
Solvent	water	1 ml	p003-p004 · Materials synthesis · Figure 2
Base	ammonia solution (Fisher Scientific UK)	375 ul · 19.4 M	p003-p004 · Materials synthesis · Figure 2
Electrolyte	tributylmethylammonium methyl sulphate (TBMAMS, 97%)	0.10 mmol	p003-p004 · Materials synthesis · Figure 2

Partial recipeSource: Both

Route 11: Other

p003-p004 · Materials synthesis · Figure 2

Metal precursorsNi nanoparticles deposited onto substrate by dc magnetron plasma sputtering source (NL50, Nikalyte Ltd.); 7000 ng cm-2 on Pt IDEs

Linker precursorsHATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)

Solvents4 ml ethanol + 1 ml water per vial (4:1 ethanol/water)

Additives375 ul 19.4 M ammonia solution; 0.10 mmol TBMAMS electrolyte

AtmosphereAir exposure during drying; dissolved oxygen participates in proposed ligand oxidation; no inert atmosphere reported.

Temperatureroom temperature

Time1

Substrate orientationPt/glass IDE with 5 um gaps

Oxidant / reductantDissolved oxygen proposed to oxidise partially deprotonated ligand radical; metal hydroxide intermediate proposed.

Work-upSolution pipetted off; substrate left to dry at room temperature in air overnight.

ActivationNone reported beyond drying in air overnight.

Scalability contextAuthors state any substrate fitting inside the sputtering chamber can be used and that the mild, salt-free, room-temperature route is potentially scalable.

Show 6 structured reagent records

Role	Reagent	Amount / concentration	Source
Metal Source	Ni nanoparticles deposited by dc magnetron plasma sputtering source	7000 ng cm-2 on Au(111); 8000 ng cm-2 on cotton; 5000 ng cm-2 on paper; 7000 ng cm-2 on Pt IDEs	p003-p004 · Materials synthesis · Figure 2
Linker	HATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)	5 ml total ligand solution per vial · 2 mM	p003-p004 · Materials synthesis · Figure 2
Solvent	ethanol	4 ml	p003-p004 · Materials synthesis · Figure 2
Solvent	water	1 ml	p003-p004 · Materials synthesis · Figure 2
Base	ammonia solution (Fisher Scientific UK)	375 ul · 19.4 M	p003-p004 · Materials synthesis · Figure 2
Electrolyte	tributylmethylammonium methyl sulphate (TBMAMS, 97%)	0.10 mmol	p003-p004 · Materials synthesis · Figure 2

Partial recipeSource: Both

Route 12: Other

p003-p004 · Materials synthesis · Figure 2

Metal precursorsNi nanoparticles deposited onto substrate by dc magnetron plasma sputtering source (NL50, Nikalyte Ltd.); 7000 ng cm-2 on Au(111)

Linker precursorsHATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)

Solvents4 ml ethanol + 1 ml water per vial (4:1 ethanol/water)

Additives375 ul 19.4 M ammonia solution; 0.10 mmol TBMAMS electrolyte

AtmosphereAir exposure during drying; dissolved oxygen participates in proposed ligand oxidation; no inert atmosphere reported.

Temperatureroom temperature

Time1

Substrate orientation300 nm Au(111) film on mica

Oxidant / reductantDissolved oxygen proposed to oxidise partially deprotonated ligand radical; metal hydroxide intermediate proposed.

Work-upSolution pipetted off; substrate left to dry at room temperature in air overnight.

ActivationNone reported beyond drying in air overnight.

Scalability contextAuthors state any substrate fitting inside the sputtering chamber can be used and that the mild, salt-free, room-temperature route is potentially scalable.

Show 6 structured reagent records

Role	Reagent	Amount / concentration	Source
Metal Source	Ni nanoparticles deposited by dc magnetron plasma sputtering source	7000 ng cm-2 on Au(111); 8000 ng cm-2 on cotton; 5000 ng cm-2 on paper; 7000 ng cm-2 on Pt IDEs	p003-p004 · Materials synthesis · Figure 2
Linker	HATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)	5 ml total ligand solution per vial · 2 mM	p003-p004 · Materials synthesis · Figure 2
Solvent	ethanol	4 ml	p003-p004 · Materials synthesis · Figure 2
Solvent	water	1 ml	p003-p004 · Materials synthesis · Figure 2
Base	ammonia solution (Fisher Scientific UK)	375 ul · 19.4 M	p003-p004 · Materials synthesis · Figure 2
Electrolyte	tributylmethylammonium methyl sulphate (TBMAMS, 97%)	0.10 mmol	p003-p004 · Materials synthesis · Figure 2

Partial recipeSource: Both

Route 13: Other

p003-p004 · Materials synthesis · Figure 2

Metal precursorsNi nanoparticles deposited onto substrate by dc magnetron plasma sputtering source (NL50, Nikalyte Ltd.); 5000 ng cm-2 on paper

Linker precursorsHATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)

Solvents4 ml ethanol + 1 ml water per vial (4:1 ethanol/water)

Additives375 ul 19.4 M ammonia solution; 0.10 mmol TBMAMS electrolyte

AtmosphereAir exposure during drying; dissolved oxygen participates in proposed ligand oxidation; no inert atmosphere reported.

Temperatureroom temperature

Time24

Substrate orientationwhite paper card later contacted with silver dag

Oxidant / reductantDissolved oxygen proposed to oxidise partially deprotonated ligand radical; metal hydroxide intermediate proposed.

Work-upSolution pipetted off; substrate left to dry at room temperature in air overnight.

ActivationNone reported beyond drying in air overnight.

Scalability contextAuthors state any substrate fitting inside the sputtering chamber can be used and that the mild, salt-free, room-temperature route is potentially scalable.

Show 6 structured reagent records

Role	Reagent	Amount / concentration	Source
Metal Source	Ni nanoparticles deposited by dc magnetron plasma sputtering source	7000 ng cm-2 on Au(111); 8000 ng cm-2 on cotton; 5000 ng cm-2 on paper; 7000 ng cm-2 on Pt IDEs	p003-p004 · Materials synthesis · Figure 2
Linker	HATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)	5 ml total ligand solution per vial · 2 mM	p003-p004 · Materials synthesis · Figure 2
Solvent	ethanol	4 ml	p003-p004 · Materials synthesis · Figure 2
Solvent	water	1 ml	p003-p004 · Materials synthesis · Figure 2
Base	ammonia solution (Fisher Scientific UK)	375 ul · 19.4 M	p003-p004 · Materials synthesis · Figure 2
Electrolyte	tributylmethylammonium methyl sulphate (TBMAMS, 97%)	0.10 mmol	p003-p004 · Materials synthesis · Figure 2

Partial recipeSource: Both

Route 14: Other

p003-p004 · Materials synthesis · Figure 2

Metal precursorsNi nanoparticles deposited onto substrate by dc magnetron plasma sputtering source (NL50, Nikalyte Ltd.); 5000 ng cm-2 on paper

Linker precursorsHATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)

Solvents4 ml ethanol + 1 ml water per vial (4:1 ethanol/water)

Additives375 ul 19.4 M ammonia solution; 0.10 mmol TBMAMS electrolyte

AtmosphereAir exposure during drying; dissolved oxygen participates in proposed ligand oxidation; no inert atmosphere reported.

Temperatureroom temperature

Time0.0167-24

Substrate orientationwhite paper card

Oxidant / reductantDissolved oxygen proposed to oxidise partially deprotonated ligand radical; metal hydroxide intermediate proposed.

Work-upSolution pipetted off; substrate left to dry at room temperature in air overnight.

ActivationNone reported beyond drying in air overnight.

Scalability contextAuthors state any substrate fitting inside the sputtering chamber can be used and that the mild, salt-free, room-temperature route is potentially scalable.

Show 6 structured reagent records

Role	Reagent	Amount / concentration	Source
Metal Source	Ni nanoparticles deposited by dc magnetron plasma sputtering source	7000 ng cm-2 on Au(111); 8000 ng cm-2 on cotton; 5000 ng cm-2 on paper; 7000 ng cm-2 on Pt IDEs	p003-p004 · Materials synthesis · Figure 2
Linker	HATP.6HCl ligand (2,3,6,7,10,11-hexaaminotriphenylene hexachloride, 97%)	5 ml total ligand solution per vial · 2 mM	p003-p004 · Materials synthesis · Figure 2
Solvent	ethanol	4 ml	p003-p004 · Materials synthesis · Figure 2
Solvent	water	1 ml	p003-p004 · Materials synthesis · Figure 2
Base	ammonia solution (Fisher Scientific UK)	375 ul · 19.4 M	p003-p004 · Materials synthesis · Figure 2
Electrolyte	tributylmethylammonium methyl sulphate (TBMAMS, 97%)	0.10 mmol	p003-p004 · Materials synthesis · Figure 2