Metal precursors0.72 g Cu(Ac)2.H2O mixed into PAN/DMF electrospinning solution; 0.1 mM Cu(Ac)2 solution for layer-by-layer growth
Linker precursors0.01 mM HHTP ethanol solution
SolventsDMF for PAN electrospinning dope; ethanol for HHTP solution and rinsing; acetone, ethanol, and deionised water for substrate cleaning
AdditivesPAN, Mw = 150000 g/mol, 0.5 g in 7.83 g DMF to form 6 wt% PAN polymer solution
AtmosphereElectrospinning at 50 +/- 3% relative humidity and 26 +/- 2 deg C; final drying under nitrogen gas
Temperature26 +/- 2 deg C during electrostatic spinning; room temperature during PAN dissolution
TimePAN dissolution 2 h; PAN/Cu(Ac)2 stirring 6 h; electrospinning 3 min; each Cu(Ac)2 and HHTP dip 2 min; up to 15 cycles
Substrate orientationn-Si or PI substrate attached to receiving drum; 20 cm drum-to-needle distance; 0.5 mm inner-diameter metal needle
Work-upSubstrates ultrasonically cleaned in acetone, ethanol, and deionised water for 30 min before use; film rinsed thoroughly with pure ethanol after each growth cycle.
ActivationDried under a stream of nitrogen gas
Scalability contextElectrospinning is described as high efficiency, low cost, easily forming films, and ultraflexible.
Show 7 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|
| Additive | PAN (Mw = 150 000 g/mol) | 0.5 g · 6 wt% PAN polymer solution | p008 · Experimental Section · Figure S3 |
| Solvent | N,N-Dimethylformamide (DMF) | 7.83 g | p008 · Experimental Section · Figure S3 |
| Metal Source | Cu(Ac)2.H2O | 0.72 g in electrospinning dope | p008 · Experimental Section · Figure S3 |
| Metal Source | Cu(Ac)2 solution | 0.1 mM | p008 · Experimental Section · Figure S3 |
| Linker | 2,3,6,7,10,11-Hexahydroxytriphenylene (HHTP) | 0.01 mM in ethanol | p008 · Experimental Section · Figure S3 |
| Solvent | anhydrous ethanol / pure ethanol | Not specified | p008 · Experimental Section · Figure S3 |
| Solvent | acetone, ethanol, deionised water | substrate cleaning solvents | p008 · Experimental Section · Figure S3 |