cMOF Evidence Base

Synthesis evidence

Uniaxially Oriented Electrically Conductive Metal-Organic Framework Nanosheets Assembled at Air/Liquid Interfaces

Ohata T., Nomoto A., Watanabe T. et al. · ACS Applied Materials and Interfaces · 2021 · 54570-54578

4 structured synthesis routes

Completeness describes how fully the route could be reconstructed from the main article and supporting information.

Complete recipeSource: Both

Route 1: Air Liquid Interface

S3-S4 / p003-p004 · Synthesis of HATP-water-NS at air/liquid interfaces · Figure S2

Metal precursorsnone
Linker precursors0.59 mM HATP solution; molecular weight calculated as HATP.6HCl
Solventsmethanol spread solution; pure water subphase
Atmosphereroom temperature
Temperatureroom temperature
Time1 h after spreading before compression
Substrate orientationair/pure water interface; transferred to substrates as needed
Work-upsurface compressed with PTFE barriers at 10 mm min-1
Show 3 structured reagent records
RoleReagentAmount / concentrationSource
LinkerHATP powder0.59 mMS3-S4 / p003-p004 · Synthesis of HATP-water-NS at air/liquid interfaces · Figure S2
SolventmethanolNot specifiedS3-S4 / p003-p004 · Synthesis of HATP-water-NS at air/liquid interfaces · Figure S2
Solventpure waterNot specifiedS3-S4 / p003-p004 · Synthesis of HATP-water-NS at air/liquid interfaces · Figure S2
Partial recipeSource: SI

Route 2: Air Liquid Interface

S4 / p004 · Synthesis of HITP-Ni-NS at air/liquid interfaces and deposition on solid substrates at pi = 0 mN m-1

Metal precursors50 mM aqueous Ni(OAc)2.4H2O
Linker precursorsHATP solution in methanol
Solventsmethanol; water
Atmosphereroom temperature
Temperatureroom temperature
Timeimmediate deposition after completion of spreading
Substrate orientationsubstrate surface parallel to the A/L interface
Work-updeposited onto solid substrates by contact with the interface
Show 3 structured reagent records
RoleReagentAmount / concentrationSource
Metal SourceNi(OAc)2.4H2O50 mM aqueous solutionS4 / p004 · Synthesis of HITP-Ni-NS at air/liquid interfaces and deposition on solid substrates at pi = 0 mN m-1
LinkerHATP powderNot specifiedS4 / p004 · Synthesis of HITP-Ni-NS at air/liquid interfaces and deposition on solid substrates at pi = 0 mN m-1
SolventmethanolNot specifiedS4 / p004 · Synthesis of HITP-Ni-NS at air/liquid interfaces and deposition on solid substrates at pi = 0 mN m-1
Complete recipeSource: Both

Route 3: Air Liquid Interface

54571-54572 / p002-p003 · Experimental Section · Figure 1

Metal precursors50 mM aqueous Ni(OAc)2.4H2O
Linker precursors0.59 mM HATP solution; molecular formula HATP.6HCl but abbreviated HATP
Solventsmethanol for HATP spread solution; water for Ni(OAc)2 subphase
Atmosphereroom temperature; nitrogen blow-drying after deposition
Temperatureroom temperature
Time1 h wait after spreading before compression; compression rate 10 mm min-1
Substrate orientationsolid substrate surface contacted parallel to the A/L interface for deposition
Work-updeposited on Si/quartz/SiO2/Si; rinsed after each deposition by immersion in pure water for 3 min and dried by nitrogen gas
Scalability contextLayer number tuned by sequential deposition cycles; compatible with multiple substrate types.
Show 4 structured reagent records
RoleReagentAmount / concentrationSource
Metal SourceNi(OAc)2.4H2O50 mM aqueous solution54571-54572 / p002-p003 · Experimental Section · Figure 1
LinkerHATP powder (HATP.6HCl)0.59 mM54571-54572 / p002-p003 · Experimental Section · Figure 1
SolventmethanolNot specified54571-54572 / p002-p003 · Experimental Section · Figure 1
SolventwaterNot specified54571-54572 / p002-p003 · Experimental Section · Figure 1
Vague recipeSource: SI

Route 4: Unknown

S4 / p004 · Synthesis of Ni3(HITP)2 bulk powder