Complete recipeSource: Main
Route 1: Liquid Liquid Interface
p002; article page 57236 · 2.4 Sensor Fabrication
Metal precursorsCu(NO3)2 aqueous solution (1 mM)
Linker precursorsBHT/chlorobenzene solution (0.1 mM in methods)
SolventsWater and chlorobenzene during synthesis; chlorobenzene/ethanol/water/acetone rinses
AdditivesCr/Au interdigitated electrodes pre-deposited on Si/SiO2
AtmosphereAmbient during growth; N2 blow-drying for substrate preparation; vacuum drying after growth
Temperature60 drying; Si/SiO2 cleaning/drying steps at 80-100 deg C
Time0.0333 h reaction (2 min); 12 h drying
Substrate orientationSi/SiO2 wafer on spin-coater vacuum chuck with interdigitated electrodes facing up
Oxidant / reductantNone reported
Work-upSpin-off and sequential 10 s rinses as in general SCIS route
ActivationVacuum oven at 60 deg C for 12 h
Scalability contextSensor prepared in one step by in situ growth on pre-deposited Au electrodes; 1.7 x 1.7 cm Si/SiO2 wafer geometry reported.
Show 4 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|---|---|---|
| Metal Source | Cu(NO3)2 aqueous solution | 100 uL in general SCIS method · 1 mM | p002; article page 57236 · 2.4 Sensor Fabrication |
| Linker | BHT in chlorobenzene | covered aqueous layer · 0.1 mM | p002; article page 57236 · 2.4 Sensor Fabrication |
| Other | Cr adhesion layer | 5 nm evaporated | p002; article page 57236 · 2.4 Sensor Fabrication |
| Other | Au electrodes | 100 nm evaporated | p002; article page 57236 · 2.4 Sensor Fabrication |