Synthesis evidence

Ultrafast in Situ Synthesis of Large-Area Conductive Metal-Organic Frameworks on Substrates for Flexible Chemiresistive Sensing

Chen X., Lu Y., Dong J. et al. · ACS Applied Materials and Interfaces · 2020 · 57235-57244

3 structured synthesis routes

Completeness describes how fully the route could be reconstructed from the main article and supporting information.

Complete recipeSource: Main

Route 1: Liquid Liquid Interface

p002; article page 57236 · 2.4 Sensor Fabrication

Metal precursorsCu(NO3)2 aqueous solution (1 mM)
Linker precursorsBHT/chlorobenzene solution (0.1 mM in methods)
SolventsWater and chlorobenzene during synthesis; chlorobenzene/ethanol/water/acetone rinses
AdditivesCr/Au interdigitated electrodes pre-deposited on Si/SiO2
AtmosphereAmbient during growth; N2 blow-drying for substrate preparation; vacuum drying after growth
Temperature60 drying; Si/SiO2 cleaning/drying steps at 80-100 deg C
Time0.0333 h reaction (2 min); 12 h drying
Substrate orientationSi/SiO2 wafer on spin-coater vacuum chuck with interdigitated electrodes facing up
Oxidant / reductantNone reported
Work-upSpin-off and sequential 10 s rinses as in general SCIS route
ActivationVacuum oven at 60 deg C for 12 h
Scalability contextSensor prepared in one step by in situ growth on pre-deposited Au electrodes; 1.7 x 1.7 cm Si/SiO2 wafer geometry reported.
Show 4 structured reagent records
RoleReagentAmount / concentrationSource
Metal SourceCu(NO3)2 aqueous solution100 uL in general SCIS method · 1 mMp002; article page 57236 · 2.4 Sensor Fabrication
LinkerBHT in chlorobenzenecovered aqueous layer · 0.1 mMp002; article page 57236 · 2.4 Sensor Fabrication
OtherCr adhesion layer5 nm evaporatedp002; article page 57236 · 2.4 Sensor Fabrication
OtherAu electrodes100 nm evaporatedp002; article page 57236 · 2.4 Sensor Fabrication
Partial recipeSource: Both

Route 2: Liquid Liquid Interface

p006; article page 57240 · 3.4 Mechanical Stability · Figure 4

Metal precursorsCu(NO3)2 aqueous solution (1 mM)
Linker precursorsBHT/chlorobenzene solution (0.1 mM in methods)
SolventsWater, chlorobenzene, ethanol and acetone
AdditivesPre-deposited Au interdigitated electrodes on PET substrate
AtmosphereAmbient growth; vacuum drying
Temperature60 drying
TimeApprox. 0.0333 h reaction for 10 nm film inferred from 2 min optimal film; 12 h drying
Substrate orientationPET/Au electrode substrate on vacuum chuck
Oxidant / reductantNone reported
Work-upPET substrate ozone-cleaned at 100 W for 1 min; SCIS film rinsed and dried as above
ActivationVacuum oven at 60 deg C for 12 h
Scalability contextDemonstrates flexible large-area device compatibility and 1000 bending cycles at 3 mm radius.
Show 3 structured reagent records
RoleReagentAmount / concentrationSource
Metal SourceCu(NO3)2 aqueous solution100 uL in general SCIS method · 1 mMp006; article page 57240 · 3.4 Mechanical Stability · Figure 4
LinkerBHT in chlorobenzenecovered aqueous layer · 0.1 mMp006; article page 57240 · 3.4 Mechanical Stability · Figure 4
OtherPET substrate with Au interdigitated electrodesNot specifiedp006; article page 57240 · 3.4 Mechanical Stability · Figure 4
Complete recipeSource: Both

Route 3: Liquid Liquid Interface

p002; article page 57236 · 2.2 In Situ Synthesis of Cu-BHT · Figure 1

Metal precursors100 uL Cu(NO3)2 aqueous solution (1 mM)
Linker precursorsBHT in chlorobenzene, 0.1 mM in the methods text; Figure 1 sketch labels 0.2 mM BHT solution
SolventsWater; chlorobenzene; rinse sequence chlorobenzene, ethanol, water and acetone
AdditivesNone reported
AtmosphereAmbient clean-room/spin-coating conditions; final drying under vacuum
Temperature60 for final drying; substrate treatments at 80-100 deg C as specified
TimeReaction from 5 s to 16 min; final drying 12 h
Substrate orientationHydroxyl-rich substrate placed horizontally on a vacuum chuck/spin coater
Oxidant / reductantNone added; Cu2+ coordinates rapidly with BHT at the aqueous-organic interface
Work-upSpin off solution (500 rpm 10 s then 1500 rpm 45 s); immerse sequentially in chlorobenzene, ethanol, water and acetone for 10 s each to remove unreacted ligand and Cu2+ ions
ActivationVacuum oven drying at 60 deg C for 12 h
Scalability contextCentimetre-sized films on glass, Si, Si/SiO2 and PET/Au substrates; film thickness tunable over 5-35 nm by reaction time.
Show 7 structured reagent records
RoleReagentAmount / concentrationSource
Metal SourceCu(NO3)2 aqueous solution100 uL · 1 mMp002; article page 57236 · 2.2 In Situ Synthesis of Cu-BHT · Figure 1
LinkerBHT (benzenehexathiol) in chlorobenzenedropped until organic layer completely covered aqueous layer · 0.1 mM (methods); 0.2 mM in Figure 1 sketchp002; article page 57236 · 2.2 In Situ Synthesis of Cu-BHT · Figure 1
SolventDI wateraqueous metal solution and rinsep002; article page 57236 · 2.2 In Situ Synthesis of Cu-BHT · Figure 1
Solventchlorobenzeneorganic linker solution and 10 s rinsep002; article page 57236 · 2.2 In Situ Synthesis of Cu-BHT · Figure 1
Solventethanol10 s rinsep002; article page 57236 · 2.2 In Situ Synthesis of Cu-BHT · Figure 1
Solventacetone10 s rinsep002; article page 57236 · 2.2 In Situ Synthesis of Cu-BHT · Figure 1
Acidpiranha solution H2SO4 (95-98%)/H2O2 (30%) = 2:1substrate treatment at 80 deg C for 2 hp002; article page 57236 · 2.2 In Situ Synthesis of Cu-BHT · Figure 1