Partial recipeSource: Main
Route 1: Other
article pages 2 and 4 · Introduction and Figure 2 discussion · Figure 2
Metal precursors1 mmol Cu(OAc)2 metal-containing solution
Linker precursors0.1 mmol BTC linker solution
SolventsNot fully specified for MOF growth in this article; ethanol rinse used in standard procedure but omitted for random films
AdditivesSAM layer on thin Au film for functionalized interface
Atmospherenot specified
Substrate orientationFunctionalized Au/SAM on silicon or quartz; preferential (001) orientation
Work-upStandard spray process described in earlier references; full workup not repeated here
Scalability contextLPE spray cycle count tunes thickness; later discussion notes s-ALD as future scalable route, not used for these HKUST-1 samples.
Show 3 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|---|---|---|
| Metal Source | Cu(OAc)2 | 1 mmol | article pages 2 and 4 · Introduction and Figure 2 discussion · Figure 2 |
| Linker | BTC | 0.1 mmol | article pages 2 and 4 · Introduction and Figure 2 discussion · Figure 2 |
| Additive | self-assembled monolayer (SAM) on Au | Not specified | article pages 2 and 4 · Introduction and Figure 2 discussion · Figure 2 |