Measurement evidence
Electrically Conductive Metal–Organic Framework Thin Film-Based On-Chip Micro-Biosensor: A Platform to Unravel Surface Morphology-Dependent Biosensing · Chen X., Dong J., Chi K. et al. · Advanced Functional Materials · 2021 · 2102855
Reported values remain attached to the sample, method, conditions, extraction quality and source location that produced them.
Pristine Cu-BHT thin film · Thin Film
FT-IR spectra in 4000-400 cm-1 region using KBr pellets compared ligand and Cu-BHT film.
| Property | Reported value | Normalised value | Uncertainty | Origin and quality | Source |
|---|---|---|---|---|---|
| Absence of residual thiol S-H peak | no -SH peak at 2490 cm-1 | — | — | Text Qualitative | p003 · Results and Discussion · Figure S3 |
Cu-BHT film on quartz wafer · Thin Film
Cu-BHT thin film transferred to quartz wafer; transmittance spectrum recorded from visible to near-infrared range.
| Property | Reported value | Normalised value | Uncertainty | Origin and quality | Source |
|---|---|---|---|---|---|
| Average optical transmittance | average transmittance approx 83%; Figure S7 label 83.14% | — | — | Figure Axis Rounded Reported | p005 · Supporting Information · Figure S7 |
Pristine Cu-BHT thin film · Thin Film
Comparison of bottom-side and up-side surfaces to quantify s-Cu and ts-Cu defect-site percentages; C 1s set to 284.8 eV for charge correction.
| Property | Reported value | Normalised value | Uncertainty | Origin and quality | Source |
|---|---|---|---|---|---|
| Cu LMM s-Cu kinetic energy | 917.9 eV | — | — | Text Exact Reported | p006 · Results and Discussion · Figure S20 |
| Bottom-side ts-Cu percentage from Cu LMM AugerMarked as a best value within this paper | ts-Cu = 41.25% | — | — | Text Exact Reported | p006 · Results and Discussion · Figure S20 |
| Cu LMM ts-Cu kinetic energy | 913.8 eV | — | — | Text Exact Reported | p006 · Results and Discussion · Figure S20 |
| Up-side ts-Cu percentage from Cu LMM Auger | ts-Cu = 27.46% | — | — | Text Exact Reported | p006 · Results and Discussion · Figure S20 |
| Cu 2p3/2 s-Cu peak binding energy | near 931.8 eV | — | — | Text Approximate | p006 · Results and Discussion · Figure 5b |
| Bottom-side ts-Cu percentage from Cu 2p XPSMarked as a best value within this paper | ts-Cu = 51.32% | — | — | Text Exact Reported | p006 · Results and Discussion · Figure 5b |
| Cu 2p3/2 ts-Cu peak binding energy | near 933.2 eV | — | — | Text Approximate | p006 · Results and Discussion · Figure 5b |
| Up-side ts-Cu percentage from Cu 2p XPS | ts-Cu = 35.24% | — | — | Text Exact Reported | p006 · Results and Discussion · Figure 5b |