Partial recipeSource: Main
Route 1: Solvothermal
22503 · 2.1.1 Synthesis of Compound 1 · Figure S21a
Metal precursorsCdCl2.2.5H2O replacing Cd(NO3)2.4H2O
Linker precursorsH2ONDI (15 mg, 0.05 mmol); oxalic acid dihydrate (6.5 mg, 0.05 mmol)
Solvents2 mL DMF, 3 mL H2O
Additives1 mL 1 M HCl
Atmospheresealed Teflon-lined autoclave; atmosphere not otherwise specified
Temperature110
Time48
Work-upAllowed to cool to room temperature at 10 C/h; pure product verified by PXRD.
Scalability contextProduct weight 9.4 mg; yield 30%.
Show 6 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|---|---|---|
| Metal Source | CdCl2.2.5H2O | not restated; replacement for Cd(NO3)2.4H2O | 22503 · 2.1.1 Synthesis of Compound 1 · Figure S21a |
| Linker | H2ONDI | 15 mg, 0.05 mmol | 22503 · 2.1.1 Synthesis of Compound 1 · Figure S21a |
| Additive | oxalic acid dihydrate | 6.5 mg, 0.05 mmol | 22503 · 2.1.1 Synthesis of Compound 1 · Figure S21a |
| Solvent | DMF | 2 mL | 22503 · 2.1.1 Synthesis of Compound 1 · Figure S21a |
| Solvent | H2O | 3 mL | 22503 · 2.1.1 Synthesis of Compound 1 · Figure S21a |
| Acid | HCl | 1 mL · 1 M | 22503 · 2.1.1 Synthesis of Compound 1 · Figure S21a |