Pore-filling estimate from literature d-spacing/pore volume, molecular length, and EDX Cu/C ratio
1-hexyne-loaded Cu(BDC) SURMOF-2 · Thin Film
Cu(BDC) pore volume and approximately 1.1 nm d-spacing combined with calculated 1-hexyne length and semi-quantitative EDX Cu/C ratio.
| Property | Reported value | Normalised value | Uncertainty | Origin and quality | Source |
|---|---|---|---|---|---|
| EDX Cu/C-derived ratio after 1-hexyne loading | Cu/C ratio up to 1.625 | — | — | Text Exact Reported | SI p.S-7 · Figure S5 discussion · Figure S5 |
| Estimated pore filling rate | <44.64% | 0.4464 fraction | less than | Text Approximate | SI p.S-7 · Figure S5 discussion · Figures S5, S7, S8 |
| Cu(BDC) d-spacing used for pore estimate | about 1.1 nm | — | — | Text Approximate | SI p.S-7 · Figure S5 discussion · Figure S5 |
| Theoretical C/Cu ratio in empty Cu(BDC) | 1.5 | — | — | Text Exact Reported | SI p.S-7 · Figure S5 discussion · Figure S5 |
| Theoretical C/Cu ratio if all pores filled | 1.78 | — | — | Text Exact Reported | SI p.S-7 · Figure S5 discussion · Figure S5 |
| Calculated 1-hexyne molecular length | 0.6 nm | — | — | Text Rounded Reported | SI p.S-7 · Figure S5 discussion · Figure S5 |
| Cu(BDC) pore volume used for filling estimate | 0.15 cm3/g | — | — | Text Exact Reported | SI p.S-7 · Figure S5 discussion · Figure S5 |