Metal precursorscopper working electrode/anode, 99.9% copper slice
Linker precursorsH3BTC (1,3,5-benzenetricarboxylic acid), 2.78 mmol
Solventsethanol (20 mL) and water (20 mL)
Additivesphosphotungstic acid (PTA), 0.278 mmol; acts as guest and electrolyte
Atmosphereair / not otherwise controlled
Temperatureroom temperature
Time0.5-8 depending on sample; common voltage series used 2 h
Substrate orientationcopper working electrode (2.5 x 2.5 cm2) immersed in reaction solution as anode; carbon rod as cathode
Oxidant / reductantelectrochemical oxidation of Cu0 anode to Cu2+ under applied direct-current voltage
Work-upAs-prepared MOF films washed thoroughly with ethanol and water to remove excess H3BTC and PTA.
ActivationDried at room temperature overnight; no further activation reported.
Scalability contextFacile room-temperature electrochemical film growth on conductive copper; applied voltage and time tune crystal size and film thickness.
Show 6 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|
| Metal Source | copper slice / copper working electrode | 2.5 x 2.5 cm2 working electrode; copper slices 99.9% | 2 · Syntheses of NENU-3 films · Scheme S1 |
| Linker | H3BTC / 1,3,5-benzenetricarboxylic acid | 2.78 mmol | 2 · Syntheses of NENU-3 films · Scheme S1 |
| Electrolyte | phosphotungstic acid (PTA) | 0.278 mmol | 2 · Syntheses of NENU-3 films · Scheme S1 |
| Solvent | ethanol | 20 mL | 2 · Syntheses of NENU-3 films · Scheme S1 |
| Solvent | water | 20 mL | 2 · Syntheses of NENU-3 films · Scheme S1 |
| Other | carbon rod cathode | not reported | 2 · Syntheses of NENU-3 films · Scheme S1 |