Metal precursorscopper acetate (1.0 mM in ethanol)
Linker precursorsHHTP (0.1 mM in ethanol)
Solventsethanol; pure ethanol rinse
Additivesfunctionalized Si, Si/SiO2, glass, Cr/Au, or mica substrates depending on measurement
AtmosphereN2 drying after each step
Temperatureroom temperature for spraying; substrate functionalization includes Piranha at 100 C and optional 3-APTS at 50 C for 24 h
Time20 s Cu spray and 40 s HHTP spray per LbL cycle; x cycles
Substrate orientation-OH functionalized substrate; face-on/c-oriented 2D planes
Oxidant / reductantnone reported
Work-uppure ethanol spray/rinse to remove residual reactants; N2 drying each step
Activationnone reported
Scalability contextSpray LbL-LPE method gives controlled thickness increment and smooth surface.
Show 3 structured reagent records
| Role | Reagent | Amount / concentration | Source |
|---|
| Metal Source | copper acetate | 1.0 mM | SI p002 · Preparation of face-on Cu-HHTP thin films |
| Linker | HHTP (2,3,6,7,10,11-hexahydrotriphenylene) | 0.1 mM | SI p002 · Preparation of face-on Cu-HHTP thin films |
| Solvent | ethanol | Not specified | SI p002 · Preparation of face-on Cu-HHTP thin films |