Computational Modelling — Mutually Noninterfering Flexible Pressure-Temperature Dual-Modal Sensors Based on Conductive Metal-Organic Framework for Electronic Skin

Measurement evidence

Computational Modelling

Mutually Noninterfering Flexible Pressure-Temperature Dual-Modal Sensors Based on Conductive Metal-Organic Framework for Electronic Skin · Li Y., Wang R., Wang G.-E. et al. · ACS Nano · 2022 · 473-484

3 measurement groups · 15 results

Reported values remain attached to the sample, method, conditions, extraction quality and source location that produced them.

CASTEP in Materials Studio 2017R2; GGA-PBE with OTFG ultrasoft pseudopotential

Ni3(HiTP)2 band-structure model under 0 and 300 kPa · Model

band structures of Ni3(HiTP)2 under 0 and 300 kPa; cutoff 500 eV; k-grid 2 x 2 x 1; tolerance 2 x 10^-5 eV

Context
pristine computational MOF model
Measurement source
482 · Macroscopic FEA Model and Microscopic First-Principles Calculations · Figure 4g-i
PropertyReported valueNormalised valueUncertaintyOrigin and qualitySource
Ni3(HiTP)2 calculated band gap without pressure0.90 eVFigure Axis
Exact Reported
479 · Figure 4h
Ni3(HiTP)2 calculated band gap under 300 kPa0.90 eVFigure Axis
Exact Reported
479 · Figure 4i
pressure effect on Ni3(HiTP)2 band gapband structure curves and band gap values remain nearly consistentQualitative
Qualitative
480 · Figure 4h-i

COMSOL Multiphysics 5.3a finite-element analysis

MOF-MSMC-5h composite film/sensor · Thin Film

thermal potential distribution under pressure 0 and 300 kPa with 40 K gradient

Context
sensor model
Measurement source
482 · Macroscopic FEA Model and Microscopic First-Principles Calculations · Figure 4; Table S6
PropertyReported valueNormalised valueUncertaintyOrigin and qualitySource
FEA unstressed contact von Mises stress0 Pa at contact partText
Exact Reported
479 · Figure 4b,c
FEA thermoelectric potential under 0 and 300 kPathermoelectric potential curves almost consistentQualitative
Qualitative
480 · Figure 4f

engineering parameters for COMSOL model

Ni3(HiTP)2 band-structure model under 0 and 300 kPa · Model

thermal conductivity, density, electrical conductivity, modulus, Poisson ratio and thermopower inputs

Context
model parameters
Measurement source
15 · Supporting Tables · Table S6
PropertyReported valueNormalised valueUncertaintyOrigin and qualitySource
COMSOL Ni3(HiTP)2 modulus input10 GPaSI Table
Exact Reported
15 · Table S6
COMSOL PDMS modulus input0.00075 GPaSI Table
Exact Reported
15 · Table S6
COMSOL Ni3(HiTP)2 thermopower input57.1 uV K^-1SI Table
Exact Reported
15 · Table S6
COMSOL Ni3(HiTP)2 density input1150 kg m^-3SI Table
Exact Reported
15 · Table S6
COMSOL electrode thermal conductivity input400 W m^-1 K^-1SI Table
Exact Reported
15 · Table S6
COMSOL Ni3(HiTP)2 thermal conductivity input0.21 W m^-1 K^-1SI Table
Exact Reported
15 · Table S6
COMSOL PDMS thermal conductivity input0.16 W m^-1 K^-1SI Table
Exact Reported
15 · Table S6
COMSOL Ni3(HiTP)2 Poisson ratio input0.7SI Table
Exact Reported
15 · Table S6
COMSOL electrode electrical conductivity input5998 S m^-1SI Table
Exact Reported
15 · Table S6
COMSOL Ni3(HiTP)2 electrical conductivity input4000 S m^-1SI Table
Exact Reported
15 · Table S6