cMOF Evidence Base

Synthesis evidence

Mutually Noninterfering Flexible Pressure-Temperature Dual-Modal Sensors Based on Conductive Metal-Organic Framework for Electronic Skin

Li Y., Wang R., Wang G.-E. et al. · ACS Nano · 2022 · 473-484

5 structured synthesis routes

Completeness describes how fully the route could be reconstructed from the main article and supporting information.

Complete recipeSource: Main

Route 1: Liquid Liquid Interface

481 · Experimental Section · Preparation of the MOF-MSMC/PP Composite Film

Metal precursorsnickel(II) chloride hexahydrate, 6.6 mg in 10 mL water
Linker precursorsHiTP (2,3,6,7,10,11-hexaaminotriphenylene), 10 mg in 10 mL water; 2,3,6,7,10,11-hexaaminotriphenylene hexahydrochloride prepared according to published work
Solventswater; ethanol and ultrapure water wash
Additivesammonium hydroxide, 300 uL
Atmospherenot specified; reaction apparently in air/open solution
Temperature65
Time2.5, 5, or 7.5
Substrate orientationMSMC membrane placed on the surface of the stirred reaction solution
Oxidant / reductantammonium hydroxide/base; no separate oxidant or reductant reported
Work-upwashed with ethanol and ultrapure water
Activationdried under vacuum at 30 C
Scalability contextLiquid-solid interfacial growth onto membrane; suitable size membrane placed at solution surface.
Show 6 structured reagent records
RoleReagentAmount / concentrationSource
LinkerHiTP (2,3,6,7,10,11-hexaaminotriphenylene)10 mg · in 10 mL water481 · Experimental Section · Preparation of the MOF-MSMC/PP Composite Film
Metal Sourcenickel(II) chloride hexahydrate6.6 mg · in 10 mL water481 · Experimental Section · Preparation of the MOF-MSMC/PP Composite Film
Baseammonium hydroxide300 uL481 · Experimental Section · Preparation of the MOF-MSMC/PP Composite Film
Solventwater10 mL + 10 mL481 · Experimental Section · Preparation of the MOF-MSMC/PP Composite Film
Solventethanolwash481 · Experimental Section · Preparation of the MOF-MSMC/PP Composite Film
OtherMSMC membranesuitable size481 · Experimental Section · Preparation of the MOF-MSMC/PP Composite Film
Complete recipeSource: Main

Route 2: Other

481 · Experimental Section · Preparation of the MOF-MSMC/PP Sensor

Metal precursorsnot applicable; uses preformed MOF-MSMC composite film
Linker precursorsnot applicable; uses preformed MOF-MSMC composite film
Solventsnone reported for assembly
AdditivesPDMS Sylgard-184 (10:1 prepolymer:curing agent), Ag paste, glue, Cu conductive wire
Atmosphereair; room temperature drying for Ag paste
Temperature80 for PDMS prepolymerization and full polymerization
Time0.083 h prepolymerization (5 min); 1 h full polymerization; 1 h Ag paste drying
Substrate orientationMOF-MSMC composite film adhered to PDMS with MOF side exposed to air; two devices overlapped with electrodes isolated from opposite MOF side
Oxidant / reductantnone
Work-upAg paste dried at room temperature; glue coated around Ag paste
ActivationPDMS completely polymerized at 80 C for 1 h
Scalability contextDevice assembly route for flexible dual-modal sensor.
Show 4 structured reagent records
RoleReagentAmount / concentrationSource
AdditivePDMS (Sylgard-184, Dow Corning, 10:1 prepolymer:curing agent)not specified481 · Experimental Section · Preparation of the MOF-MSMC/PP Sensor
AdditiveAg pastenot specified481 · Experimental Section · Preparation of the MOF-MSMC/PP Sensor
Additivegluenot specified481 · Experimental Section · Preparation of the MOF-MSMC/PP Sensor
OtherCu conductive wireone wire at one end per device481 · Experimental Section · Preparation of the MOF-MSMC/PP Sensor
Complete recipeSource: Main

Route 3: Other

481 · Experimental Section · Preparation of the MOF-MSMC/PP Sensor

Metal precursorsnot applicable; uses preformed MOF-MSMC composite film
Linker precursorsnot applicable; uses preformed MOF-MSMC composite film
Solventsnone reported
AdditivesCu conductive wires, Ag paste, glue
Atmosphereair; room-temperature Ag paste drying
Temperatureroom temperature for Ag paste drying
Time1 h Ag paste drying
Substrate orientationtwo Cu conductive wires installed separately at two sides of MOF-MSMC composite film
Oxidant / reductantnone
Work-upglue coated around Ag paste after drying
Activationnone
Scalability contextDevice-specific tensile test assembly.
Show 4 structured reagent records
RoleReagentAmount / concentrationSource
OtherMOF-MSMC composite filmnot specified481 · Experimental Section · Preparation of the MOF-MSMC/PP Sensor
OtherCu conductive wirestwo481 · Experimental Section · Preparation of the MOF-MSMC/PP Sensor
AdditiveAg pastenot specified481 · Experimental Section · Preparation of the MOF-MSMC/PP Sensor
Additivegluenot specified481 · Experimental Section · Preparation of the MOF-MSMC/PP Sensor
Complete recipeSource: Main

Route 4: Liquid Liquid Interface

481 · Experimental Section · Preparation of the MOF-MSMC/PP Composite Film

Metal precursorsnickel(II) chloride hexahydrate, same as MOF-MSMC route
Linker precursorsHiTP, same as MOF-MSMC route
Solventswater; ethanol and ultrapure water wash
Additivesammonium hydroxide, 300 uL
Atmospherenot specified; reaction apparently in air/open solution
Temperature65
Time5
Substrate orientationPP membrane substituted for MSMC membrane at solution surface
Oxidant / reductantammonium hydroxide/base; no separate oxidant or reductant reported
Work-upwashed with ethanol and ultrapure water
Activationdried under vacuum at 30 C
Scalability contextControl substrate fabricated following same procedure.
Show 4 structured reagent records
RoleReagentAmount / concentrationSource
LinkerHiTP (2,3,6,7,10,11-hexaaminotriphenylene)10 mg · in 10 mL water481 · Experimental Section · Preparation of the MOF-MSMC/PP Composite Film
Metal Sourcenickel(II) chloride hexahydrate6.6 mg · in 10 mL water481 · Experimental Section · Preparation of the MOF-MSMC/PP Composite Film
Baseammonium hydroxide300 uL481 · Experimental Section · Preparation of the MOF-MSMC/PP Composite Film
OtherPP membranesuitable size481 · Experimental Section · Preparation of the MOF-MSMC/PP Composite Film
Partial recipeSource: Main

Route 5: Other

481 · Experimental Section · Preparation of the MOF-MSMC/PP Sensor

Metal precursorsnot applicable; uses preformed MOF-PP composite film
Linker precursorsnot applicable; uses preformed MOF-PP composite film
Solventsnone reported for assembly
AdditivesPDMS, Ag paste, glue, Cu conductive wire
Atmosphereair; room temperature PDMS polymerization for PP device
Temperatureroom temperature for complete PDMS polymerization
Time1 h Ag paste drying; PDMS polymerization time not specified
Substrate orientationMSMC membrane substituted by PP membrane
Oxidant / reductantnone
Work-upAg paste dried at room temperature; glue coated around Ag paste
Activationcomplete polymerization at room temperature
Scalability contextControl device route; room-temperature polymerization preserves PP membrane conductivity.
Show 3 structured reagent records
RoleReagentAmount / concentrationSource
AdditivePDMSnot specified481 · Experimental Section · Preparation of the MOF-MSMC/PP Sensor
AdditiveAg pastenot specified481 · Experimental Section · Preparation of the MOF-MSMC/PP Sensor
OtherCu conductive wirenot specified481 · Experimental Section · Preparation of the MOF-MSMC/PP Sensor