AFM, contact angle and TGA
Ni/Cu-MOFs (7:1)-FET · Electrode
AFM roughness, water contact angle and TGA thermal decomposition values discussed from supporting figures.
| Property | Reported value | Normalised value | Uncertainty | Origin and quality | Source |
|---|---|---|---|---|---|
| average surface roughness of Ni-MOFs | 28.55 nm | — | — | Text Exact Reported | S5 · 3.1 · Fig. S2 |
| average surface roughness of Ni/Cu-MOFs (7:1)Marked as a best value within this paper | 48.27 nm | — | — | Text Exact Reported | S5 · 3.1 · Fig. S2 |
| water contact angle of GA-Ni/Cu-MOFs (7:1)Marked as a best value within this paper | 52.44 deg | — | — | Text Exact Reported | S5 · 3.1 · Fig. S3 |
| water contact angle of Ni-MOFs | 132.20 deg | — | — | Text Exact Reported | S5 · 3.1 · Fig. S3 |
| water contact angle of Ni/Cu-MOFs (7:1)Marked as a best value within this paper | 101.69 deg | — | — | Text Exact Reported | S5 · 3.1 · Fig. S3 |
| Ni-MOFs and Cu-MOFs decomposition temperatures | Ni-MOFs 304 degC; Cu-MOFs 235 degC | — | — | Text Rounded Reported | 5 · 3.1 · Fig. S5 |
| Ni/Cu-MOFs (7:1) thermal decomposition temperature | about 270 degC | — | about | Text Approximate | 5 · 3.1 · Fig. S5 |