Luder L., Gubicza A., Stiefel M. et al. · Advanced Electronic Materials · 2022 · 2100871
Open a family to keep every result attached to its sample, method and conditions.
Paraphrased for this database from the authors’ stated interpretations — never quoted verbatim — and kept separate from reported measurements.
Cu-HHTP-TCNQ films show a chemiresistive resistance response to ambient environmental changes, with ambient humid air causing the largest resistance increase among tested gases.
Caveat: Application demonstration is proof-of-principle; gas selectivity mechanism remains unresolved.
7 · 2.7. Chemiresistive Response · Figure 4g,h · Linked to 4 structured results
The reported conductivity is an average film quantity, not an intrinsic single-material property, because the film thickness varies and the film contains different phases.
7 · 2.6. Electrical Properties · Figure 4f · Linked to 3 structured results
The film is a hybrid architecture with Cu-HHTP-rich filamentous continuous regions and Cu-TCNQ(I)-rich cubic crystalline regions embedded in a largely amorphous film.
Caveat: EDX alone cannot prove coordination; assignment relies on combined EDX, Raman, and XRD.
7 · 3. Conclusions · Linked to 7 structured results
GI-SAXS indicates nanoscale pores in the hybrid Cu-HHTP-TCNQ film.
Caveat: GI-SAXS supports nanoscale porosity qualitatively; no BET surface area or pore-size distribution is reported.
6 · 2.5. X-Ray Diffraction · Figure S7 · Linked to 2 structured results
Continuous Cu-HHTP-TCNQ film growth requires combining both HHTP and TCNQ; HHTP alone gives nonconnected powder and TCNQ alone shows no macroscopic reaction.
Caveat: Control observations are qualitative and no SI video was supplied.
3 · 2.1. Synthesis · Figure 1 · Linked to 3 structured results
Around room temperature, Cu-HHTP-TCNQ conductivity follows a thermally activated process with activation energy about 0.142 eV.
Caveat: Based on two representative samples in SI Figure S8; detailed digitisation of the plotted conductivity-temperature curves was not performed.
10 · Figure S8 caption · Figure S8 · Linked to 1 structured result
Names and aliases are kept exactly within the paper’s own identity model.
| Material | Composition | Structure context | Source |
|---|---|---|---|
| Cu-HHTP phase in hybrid filmBrowse family: Cu₃(HHTP)₂ / Cu–HHTP | Cu-HHTPCu(II) / Cu2+ ions · HHTP | 2D · PristineAssigned from XRD reflections (100), (200), and (001), and from oxygen-rich filamentous continuous regions. | 5 · 2.5. X-Ray Diffraction · Figure 3f,g |
| Cu-HHTP-TCNQ hybrid metal-organic framework filmBrowse family: Cu₃(HHTP)₂ / Cu–HHTP | Cu-HHTP-TCNQCu(II) / Cu2+ ions · 2,3,6,7,10,11-hexahydroxytriphenylene (HHTP); 7,7,8,8-tetracyanoquinodimethane (TCNQ) | unknown · CompositeHybrid low-long-range-order coordination polymer/MOF-like film containing Cu-HHTP filamentous continuous regions and Cu-TCNQ(I) cubic crystalline regions, with high amorphous background. | 2 · Introduction / Results and Discussion |
| Cu-TCNQ phase I in hybrid film | Cu-TCNQ(I)Cu ions · TCNQ | unknown · PristineAssigned from Raman-shifted coordinated TCNQ and XRD indexing of Cu-TCNQ phase I reflections; no phase II features detected. | 5 · 2.5. X-Ray Diffraction · Figure 3f,g |
Sample form, processing state and composition status define the context for measurements.
| Sample | Form and role | Processing and geometry | Source |
|---|---|---|---|
| HHTP-only copper reaction controlresearch_0130__mat__mat_cu_hhtp_phase | Powder · Pristine Control · Pristine Framework | Sole addition of HHTP to copper ions in the interfacial system; slow nonconnected powder after 1 h.None | 3 · 2.1. Synthesis |
| Cu-HHTP-TCNQ film on glass chip with prepatterned gold electrodes, 45 minresearch_0130__mat__mat_cu_hhtp_tcnq | Electrode · Target Sample · Composite | Synthesised at 0 C for 45 min and deposited on gold-electrode chip; used for representative I-V and gas-response data.Glass/fused silica chip with Ti/Au electrodes and Al2O3 passivation · 403 +/- 40 nm for 45 min reaction time from SI Figure S3; device sensing sample also synthesised at 0 C for 45 min. | 6 · 2.6. Electrical Properties · Figure 4d,g |
| Cu-HHTP-TCNQ thin-film reaction-time seriesresearch_0130__mat__mat_cu_hhtp_tcnq | Thin Film · Target Sample · Composite | Interfacial film deposited by draining liquid phases, dried in air, washed with acetone and isopropyl alcohol, dried again in air.Freestanding at liquid-liquid interface; transferred to substrate of choice, including glass with prepatterned gold electrodes. · AFM line-profile labels in SI Figure S3: 123 +/- 9 nm (10 min), 210 +/- 15 nm (20 min), 189 +/- 15 nm (30 min), 403 +/- 40 nm (45 min), 391 +/- 41 nm (60 min), 355 +/- 75 nm (80 min). | 5 · Figure S3 · Figure S3 |
| Cu-HHTP-TCNQ film on silicon wafer for GI-SAXS, 40 minresearch_0130__mat__mat_cu_hhtp_tcnq | Thin Film · Target Sample · Composite | Synthesised by standard interfacial procedure at 0 C for 40 min and deposited onto plasma-treated silicon wafer.Silicon wafer, orientation (100), 500 um thick with 285 nm native SiO2 | 8 · Experimental Section / Grazing-Incidence Small-Angle X-Ray Scattering · Figure S7 |
| Cu-HHTP-TCNQ film on copper TEM grid, 40 minresearch_0130__mat__mat_cu_hhtp_tcnq | Thin Film · Target Sample · Composite | Synthesised by standard interfacial procedure at 0 C for 40 min and fished onto a copper grid.Copper TEM grid (G2400C, square 400 mesh, Cu 3.05 mm diameter) | 8 · Experimental Section / Transmission Electron Microscopy · Figure S6 |
| Merged Cu-HHTP-TCNQ film powder for XRDresearch_0130__mat__mat_cu_hhtp_tcnq | Powder · Target Sample · Composite | Repeated standard interfacial syntheses at 0 C for 45 min; films merged to obtain powder for XRD.None / powder collected from repeated syntheses | 8 · Experimental Section / X-Ray Diffraction · Figure 3f,g |