cMOF Evidence Base
Microscopy Morphology — Conductive Hybrid Cu-HHTP-TCNQ Metal–Organic Frameworks for Chemiresistive Sensing

Measurement evidence

Microscopy Morphology

Conductive Hybrid Cu-HHTP-TCNQ Metal–Organic Frameworks for Chemiresistive Sensing · Luder L., Gubicza A., Stiefel M. et al. · Advanced Electronic Materials · 2022 · 2100871

2 measurement groups · 13 results

Reported values remain attached to the sample, method, conditions, extraction quality and source location that produced them.

Atomic force microscopy (AFM) topography and line-profile analysis

Atomic force microscopy

Cu-HHTP-TCNQ thin-film reaction-time series · Thin Film

AFM tapping mode under standard laboratory conditions; five edge positions for thickness and five film sections for RMS roughness over 10-80 min reaction times.

Atmosphere
Ambient laboratory conditions; no environmental control
Context
Hybrid film growth series
Measurement source
4 · 2.2. Surface Morphology · Figure 2i,j
PropertyReported valueNormalised valueUncertaintyOrigin and qualitySource
Mean RMS roughness at 10 minabout 35 nm from Figure 2j——Figure Axis
Approximate		4 · 2.2. Surface Morphology · Figure 2j
Mean RMS roughness at 20 minabout 85 nm from Figure 2j——Figure Axis
Approximate		4 · 2.2. Surface Morphology · Figure 2j
Mean RMS roughness at 30 minabout 80 nm from Figure 2j——Figure Axis
Approximate		4 · 2.2. Surface Morphology · Figure 2j
Mean RMS roughness at 45 minabout 100 nm from Figure 2j——Figure Axis
Approximate		4 · 2.2. Surface Morphology · Figure 2j
Mean RMS roughness at 60 minabout 115 nm from Figure 2j——Figure Axis
Approximate		4 · 2.2. Surface Morphology · Figure 2j
Mean RMS roughness at 80 minabout 125 nm from Figure 2j——Figure Axis
Approximate		4 · 2.2. Surface Morphology · Figure 2j
Mean film thickness at 10 min123 +/- 9 nm from SI Figure S3 line-profile annotation—9 nmFigure Axis
Rounded Reported		5 · Figure S3 · Figure S3
Mean film thickness at 20 min210 +/- 15 nm from SI Figure S3 line-profile annotation—15 nmFigure Axis
Rounded Reported		5 · Figure S3 · Figure S3
Mean film thickness at 30 min189 +/- 15 nm from SI Figure S3 line-profile annotation—15 nmFigure Axis
Rounded Reported		5 · Figure S3 · Figure S3
Mean film thickness at 45 min403 +/- 40 nm from SI Figure S3 line-profile annotation—40 nmFigure Axis
Rounded Reported		5 · Figure S3 · Figure S3
Mean film thickness at 60 min391 +/- 41 nm from SI Figure S3 line-profile annotation—41 nmFigure Axis
Rounded Reported		5 · Figure S3 · Figure S3
Mean film thickness at 80 min355 +/- 75 nm from SI Figure S3 line-profile annotation—75 nmFigure Axis
Rounded Reported		5 · Figure S3 · Figure S3

Scanning electron microscopy (SEM)

Scanning electron microscopy

Cu-HHTP-TCNQ thin-film reaction-time series · Thin Film

Top and bottom/angled SEM imaging of 60 min Cu-HHTP-TCNQ thin films.

Context
Hybrid composite morphology
Measurement source
4 · 2.2. Surface Morphology · Figure 2a,b
PropertyReported valueNormalised valueUncertaintyOrigin and qualitySource
SEM morphologyElongated filamentous continuous layer with gaps; cubic crystalline entities on film backside; occasional long rods.——Text
Qualitative		3 · 2.2. Surface Morphology · Figure 2a,b