Electrochemistry Application — Ligand-Oxidation-Based Anodic Synthesis of Oriented Films of Conductive M-Catecholate Metal-Organic Frameworks with Controllable Thickness

3 measurement groups · 17 results

Reported values remain attached to the sample, method, conditions, extraction quality and source location that produced them.

Ag-electroplated Cu3(HHTP)2 film electrode · Electrode

Cu3(HHTP)2 film used as an electrode for electroplating Ag from 0.05 M AgNO3 at -0.1 V for 1 min.

Property	Reported value	Normalised value	Uncertainty	Origin and quality	Source
AgNO3 electrolyte concentration	0.05 M AgNO3	—	—	Caption Exact Reported	SI p.25 · Supplementary data · Fig. S22
Ag deposition observation	large Ag crystals quickly formed on MOF film surface	—	—	Text Qualitative	main p.5, article p.25574 · Results and Discussion · Fig. S22
Ag electroplating potential	-0.1 V	—	—	Caption Exact Reported	SI p.25 · Supplementary data · Fig. S22
Ag electroplating time	1 min	—	—	Caption Exact Reported	SI p.25 · Supplementary data · Fig. S22

Cu3(HHTP)2 film on Au/Cr/glass anode deposited at 0.25 V for 45 min · Thin Film

Background, Cu(NO3)2, HHTP and Cu3(HHTP)2 precursor solutions; 100 mV/s, pH 3.3, NaCl 100 mM, 30 C, nitrogen purged.

Temperature: 303
Atmosphere: Nitrogen-saturated
Geometry: 3 mm glassy carbon working electrode; Pt coil counter; Ag/AgCl reference
Context: Mechanism study for pristine Cu3(HHTP)2 synthesis.
Measurement source: main p.3-4, article pp.25572-25573 · Results and Discussion · Fig. 3a

Property	Reported value	Normalised value	Uncertainty	Origin and quality	Source
background-solution stable potential window	-0.2 to 0.5 V	—	—	Text Range	main p.3, article p.25572 · Results and Discussion · Fig. 3a
Cu+/Cu2+ anodic peak	0.16 V	—	—	Text Rounded Reported	main p.3, article p.25572 · Results and Discussion · Fig. 3a
Cu2+/Cu+ cathodic peak	0.04 V	—	—	Text Rounded Reported	main p.3, article p.25572 · Results and Discussion · Fig. 3a
HHTP first anodic peak	0.35 V	—	—	Text Rounded Reported	main p.3, article p.25572 · Results and Discussion · Fig. 3a
HHTP second anodic peak	0.55 V	—	—	Text Rounded Reported	main p.3, article p.25572 · Results and Discussion · Fig. 3a
HHTP third anodic peak	0.85 V	—	—	Text Rounded Reported	main p.3, article p.25572 · Results and Discussion · Fig. 3a
precursor shifted first HHTP-oxidation peak	0.34 V	—	—	Text Rounded Reported	main p.3, article p.25572 · Results and Discussion · Fig. 3a
precursor shifted second HHTP-oxidation peak	0.50 V	—	—	Text Rounded Reported	main p.3, article p.25572 · Results and Discussion · Fig. 3a
precursor shifted third HHTP-oxidation peak	0.58 V	—	—	Text Rounded Reported	main p.3, article p.25572 · Results and Discussion · Fig. 3a
CV scan rate	100 mV s-1	—	—	Caption Exact Reported	main p.4, article p.25573 · Results and Discussion · Fig. 3 caption

Cu3(HHTP)2 Au-film growth kinetics series · Thin Film

CV deposition -0.2 to 0.35 V at 100 mV/s; potentiostatic deposition at 0.30 V on a 3 mm GCE.

Geometry: 3 mm glassy carbon electrode
Context: Conductive-growth mechanism proof.
Measurement source: main p.5, article p.25574 · Results and Discussion · Fig. S21

Property	Reported value	Normalised value	Uncertainty	Origin and quality	Source
CV deposition potential range	-0.2 to 0.35 V	—	—	Text Range	main p.5, article p.25574 · Results and Discussion · Fig. S21a
electrode-surface passivation assessment	near-identical current-potential curves after first scan; surface not passivated	—	—	Text Qualitative	main p.5, article p.25574 · Results and Discussion · Fig. S21a
steady potentiostatic deposition current	~40 uA	—	—	Text Approximate	main p.5, article p.25574 · Results and Discussion · Fig. S21b